Part Details for M2S060TS-FG484 by Microsemi Corporation
Results Overview of M2S060TS-FG484 by Microsemi Corporation
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Applications
Consumer Electronics
Internet of Things (IoT)
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Computing and Data Storage
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Aerospace and Defense
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Automotive
M2S060TS-FG484 Information
M2S060TS-FG484 by Microsemi Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for M2S060TS-FG484
M2S060TS-FG484 CAD Models
M2S060TS-FG484 Part Data Attributes
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M2S060TS-FG484
Microsemi Corporation
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Datasheet
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M2S060TS-FG484
Microsemi Corporation
Field Programmable Gate Array, 56520-Cell, CMOS, PBGA484, FBGA-484
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | FBGA-484 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-PBGA-B484 | |
| JESD-609 Code | e0 | |
| Length | 23 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Inputs | 267 | |
| Number of Logic Cells | 56520 | |
| Number of Outputs | 267 | |
| Number of Terminals | 484 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 240 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.44 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 23 mm |