Part Details for M2S060T-FGG484I by Microsemi Corporation
Results Overview of M2S060T-FGG484I by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Financial Technology (Fintech)
Computing and Data Storage
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Aerospace and Defense
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Communication and Networking
Automotive
M2S060T-FGG484I Information
M2S060T-FGG484I by Microsemi Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for M2S060T-FGG484I
M2S060T-FGG484I CAD Models
M2S060T-FGG484I Part Data Attributes
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M2S060T-FGG484I
Microsemi Corporation
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Datasheet
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M2S060T-FGG484I
Microsemi Corporation
Field Programmable Gate Array, 56520-Cell, CMOS, PBGA484, FBGA-484
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | FBGA-484 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-PBGA-B484 | |
| JESD-609 Code | e1 | |
| Length | 23 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Inputs | 267 | |
| Number of Logic Cells | 56520 | |
| Number of Outputs | 267 | |
| Number of Terminals | 484 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 250 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.44 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 23 mm |
Alternate Parts for M2S060T-FGG484I
This table gives cross-reference parts and alternative options found for M2S060T-FGG484I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M2S060T-FGG484I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| M2S060T-FG484 | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 56520-Cell, CMOS, PBGA484, FBGA-484 | M2S060T-FGG484I vs M2S060T-FG484 |
M2S060T-FGG484I Frequently Asked Questions (FAQ)
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Microsemi provides a PCB design guide and layout recommendations in their documentation, including the 'M2S060T-FGG484I FPGA PCB Design Guide' and 'Microsemi FPGA PCB Design and Layout Guidelines'. Following these guidelines can help ensure signal integrity and minimize noise.
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Microsemi recommends using a multi-layer PCB with a dedicated power plane, and following the power supply design guidelines in the 'M2S060T-FGG484I FPGA Power Supply Design Guide'. Additionally, using a high-quality voltage regulator and decoupling capacitors can help ensure a stable power supply.
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The M2S060T-FGG484I FPGA has a maximum junction temperature of 100°C. To manage thermal performance, Microsemi recommends using a heat sink, thermal interface material, and following the thermal management guidelines in the 'M2S060T-FGG484I FPGA Thermal Management Guide'.
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Microsemi recommends using a secure configuration method, such as AES encryption, and following the configuration guidelines in the 'M2S060T-FGG484I FPGA Configuration Guide'. Additionally, using a secure boot mechanism and implementing access controls can help prevent unauthorized access.
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The M2S060T-FGG484I FPGA is designed to meet the requirements of various environmental and radiation standards, including MIL-STD-883 and NASA EEE-INST-002. Microsemi provides detailed information on environmental and radiation testing in the 'M2S060T-FGG484I FPGA Environmental and Radiation Testing Guide'.