Part Details for M2S060-FCSG325I by Microsemi Corporation
Results Overview of M2S060-FCSG325I by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (2 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
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Automotive
M2S060-FCSG325I Information
M2S060-FCSG325I by Microsemi Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for M2S060-FCSG325I
M2S060-FCSG325I CAD Models
M2S060-FCSG325I Part Data Attributes
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M2S060-FCSG325I
Microsemi Corporation
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Datasheet
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M2S060-FCSG325I
Microsemi Corporation
Field Programmable Gate Array, 56520-Cell, CMOS, PBGA325, FBGA-325
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | FBGA-325 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Microsemi Corporation | |
| Additional Feature | LG-MIN, WD-MIN | |
| JESD-30 Code | S-PBGA-B325 | |
| JESD-609 Code | e1 | |
| Length | 11 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Inputs | 200 | |
| Number of Logic Cells | 56520 | |
| Number of Outputs | 200 | |
| Number of Terminals | 325 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA325,21X21,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 250 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.01 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 11 mm |
Alternate Parts for M2S060-FCSG325I
This table gives cross-reference parts and alternative options found for M2S060-FCSG325I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M2S060-FCSG325I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| M2S060-FCS325 | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 56520-Cell, CMOS, PBGA325, FBGA-325 | M2S060-FCSG325I vs M2S060-FCS325 |
| M2S060-FCS325I | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 56520-Cell, CMOS, PBGA325, FBGA-325 | M2S060-FCSG325I vs M2S060-FCS325I |
M2S060-FCSG325I Frequently Asked Questions (FAQ)
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Microsemi provides a PCB design guide that includes layout and routing guidelines for the M2S060-FCSG325I. It's recommended to follow these guidelines to ensure signal integrity and minimize electromagnetic interference (EMI).
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A POR circuit can be implemented using a voltage supervisor IC, such as the Microsemi MIC2777, which provides a reset signal to the FPGA during power-up. The FPGA's internal POR circuit can also be used in conjunction with an external capacitor to ensure a reliable reset.
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The M2S060-FCSG325I has a maximum junction temperature of 100°C. To ensure reliable operation, it's recommended to use a heat sink or thermal interface material to keep the junction temperature below 85°C. A thermal analysis should be performed to determine the required heat sink size and airflow requirements.
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Power consumption can be optimized by using the FPGA's power-saving features, such as dynamic voltage and frequency scaling, clock gating, and power gating. Additionally, using a low-power mode, such as the 'sleep' mode, can reduce power consumption when the FPGA is not actively processing data.
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The M2S060-FCSG325I has a range of security features, including a secure boot mechanism, encrypted bitstream storage, and a hardware-based cryptographic engine. These features can be used to protect the FPGA's configuration and data from unauthorized access.