Part Details for M2S060-FCSG325I by Microchip Technology Inc
Results Overview of M2S060-FCSG325I by Microchip Technology Inc
- Distributor Offerings: (12 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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M2S060-FCSG325I Information
M2S060-FCSG325I by Microchip Technology Inc is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for M2S060-FCSG325I
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
33AJ8417
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Newark | Smartfusion2 Soc Fpga, Arm Cortex-M3, 56.5Kles 325 Tfbga 11X11X1.01Mm Tray Rohs Compliant: Yes |Microchip M2S060-FCSG325I RoHS: Compliant Min Qty: 176 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$110.2900 / $116.7100 | Buy Now |
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DISTI #
1100-1362-ND
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DigiKey | IC SOC CORTEX-M3 166MHZ 325BGA Min Qty: 1 Lead time: 14 Weeks Container: Tray |
790 In Stock |
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$118.4200 | Buy Now |
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DISTI #
M2S060-FCSG325I
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Avnet Americas | FPGA SmartFusion2 56520 Cells 65nm Technology 1.2V 325-Pin FC-BGA - Trays (Alt: M2S060-FCSG325I) RoHS: Compliant Min Qty: 176 Package Multiple: 176 Lead time: 14 Weeks, 0 Days Container: Tray | 0 |
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$94.1968 / $100.6375 | Buy Now |
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DISTI #
494-M2S060-FCSG325I
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Mouser Electronics | SoC FPGA SmartFusion2 SoC FPGA, ARM Cortex-M3, 56.5KLEs RoHS: Compliant | 0 |
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$116.7100 | Order Now |
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DISTI #
M2S060-FCSG325I
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Microchip Technology Inc | SmartFusion2 SoC FPGA, ARM Cortex-M3, 56.5KLEs, TFBGA, Projected EOL: 2049-02-04 COO: South Korea ECCN: 3A991.d RoHS: Compliant Lead time: 14 Weeks, 0 Days Container: Tray |
0 Alternates Available |
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$56.3000 / $118.4200 | Buy Now |
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Onlinecomponents.com | RoHS: Compliant | 15 Factory Stock |
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$102.0400 / $329.4500 | Buy Now |
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NAC | M2S060-FCSG325I RoHS: Compliant Min Qty: 176 Package Multiple: 176 Container: Tray | 0 |
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$98.1800 / $115.0100 | Buy Now |
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DISTI #
M2S060-FCSG325I
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Avnet Silica | FPGA SmartFusion2 56520 Cells 65nm Technology 12V 325Pin FCBGA (Alt: M2S060-FCSG325I) RoHS: Compliant Min Qty: 176 Package Multiple: 176 Lead time: 16 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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Cytech Systems Limited | IC SOC CORTEX-M3 166MHZ 325BGA | 880 |
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RFQ | |
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DISTI #
M2S060-FCSG325I
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EBV Elektronik | FPGA SmartFusion2 56520 Cells 65nm Technology 12V 325Pin FCBGA (Alt: M2S060-FCSG325I) RoHS: Compliant Min Qty: 176 Package Multiple: 176 Lead time: 15 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for M2S060-FCSG325I
M2S060-FCSG325I CAD Models
M2S060-FCSG325I Part Data Attributes
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M2S060-FCSG325I
Microchip Technology Inc
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Datasheet
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M2S060-FCSG325I
Microchip Technology Inc
Field Programmable Gate Array, 56520-Cell, CMOS, PBGA325
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | FCBGA-325 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 14 Weeks | |
| Samacsys Manufacturer | Microchip | |
| JESD-30 Code | S-PBGA-B325 | |
| Length | 11 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Inputs | 200 | |
| Number of Logic Cells | 56520 | |
| Number of Outputs | 200 | |
| Number of Terminals | 325 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA325,21X21,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 250 | |
| Programmable Logic Type | FPGA SOC | |
| Seated Height-Max | 1.01 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 11 mm |
M2S060-FCSG325I Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
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A POR circuit can be implemented using an external resistor and capacitor connected to the POR pin. The recommended values are R = 1 kΩ and C = 10 μF. This ensures a reliable reset signal during power-up.
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The M2S060-FCSG325I supports DDR3 frequencies up to 1066 Mbps. However, the actual frequency may vary depending on the system design and memory configuration.
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To optimize for low power consumption, use the device's power-saving features such as clock gating, dynamic voltage and frequency scaling, and power islands. Additionally, optimize the system's clock frequency and voltage to minimize power consumption.
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The recommended JTAG interface configuration is to use a 10-pin connector with a 3.3V signal level. The JTAG clock frequency should be limited to 10 MHz to ensure reliable operation.