Part Details for M2GL150T-1FCG1152I by Microsemi Corporation
Results Overview of M2GL150T-1FCG1152I by Microsemi Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Financial Technology (Fintech)
Computing and Data Storage
Smart Cities
Aerospace and Defense
Telecommunications
Communication and Networking
Automotive
M2GL150T-1FCG1152I Information
M2GL150T-1FCG1152I by Microsemi Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for M2GL150T-1FCG1152I
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
M2GL150T1FCG115
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Richardson RFPD | MULTI-FUNCTION CHIP SET RoHS: Not Compliant Min Qty: 1 | 0 |
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RFQ |
Part Details for M2GL150T-1FCG1152I
M2GL150T-1FCG1152I CAD Models
M2GL150T-1FCG1152I Part Data Attributes
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M2GL150T-1FCG1152I
Microsemi Corporation
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Datasheet
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M2GL150T-1FCG1152I
Microsemi Corporation
Field Programmable Gate Array, 146124-Cell, PBGA1152, 35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | 35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Microsemi Corporation | |
| JESD-30 Code | S-PBGA-B1152 | |
| Length | 35 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of Inputs | 574 | |
| Number of Logic Cells | 146124 | |
| Number of Outputs | 574 | |
| Number of Terminals | 1152 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.9 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm |
Alternate Parts for M2GL150T-1FCG1152I
This table gives cross-reference parts and alternative options found for M2GL150T-1FCG1152I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M2GL150T-1FCG1152I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| M2GL150T-1FC1152I | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 146124-Cell, PBGA1152, 35 X 35 MM, 1 MM PITCH, FBGA-1152 | M2GL150T-1FCG1152I vs M2GL150T-1FC1152I |
M2GL150T-1FCG1152I Frequently Asked Questions (FAQ)
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Microsemi provides a PCB design guide and layout recommendations in their documentation, including guidelines for signal integrity, power distribution, and thermal management. It's essential to follow these guidelines to ensure reliable operation and minimize signal degradation.
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The power-up sequence should follow the recommended power-on reset (POR) timing, ensuring that the power supplies are stable before configuring the FPGA. A well-designed power-up sequence can prevent damage to the device and ensure reliable operation.
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Proper thermal management is crucial to prevent overheating. Use a heat sink or thermal interface material, ensure good airflow, and follow Microsemi's thermal design guidelines. Monitor the device temperature and adjust the design as needed to prevent thermal throttling or shutdown.
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Optimize the design by minimizing clock frequencies, using power-gating, and reducing switching activity. Use Microsemi's PowerPro software to estimate and optimize power consumption. Additionally, consider using low-power modes, such as sleep or hibernate, when the FPGA is not in use.
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Follow Microsemi's signal integrity guidelines, including using differential signaling, minimizing signal lengths, and using signal termination. Implement EMI mitigation techniques, such as shielding, grounding, and filtering, to reduce electromagnetic radiation and susceptibility.