Part Details for M2GL010-FGG484 by Microsemi Corporation
Results Overview of M2GL010-FGG484 by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
M2GL010-FGG484 Information
M2GL010-FGG484 by Microsemi Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for M2GL010-FGG484
M2GL010-FGG484 CAD Models
M2GL010-FGG484 Part Data Attributes
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M2GL010-FGG484
Microsemi Corporation
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Datasheet
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M2GL010-FGG484
Microsemi Corporation
Field Programmable Gate Array, 12084-Cell, PBGA484, 23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | 23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Microsemi Corporation | |
| JESD-30 Code | S-PBGA-B484 | |
| Length | 23 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Inputs | 233 | |
| Number of Logic Cells | 12084 | |
| Number of Outputs | 233 | |
| Number of Terminals | 484 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 250 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.44 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 23 mm |
Alternate Parts for M2GL010-FGG484
This table gives cross-reference parts and alternative options found for M2GL010-FGG484. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M2GL010-FGG484, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
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| M2GL010-FGG484 | Microchip Technology Inc | $44.4135 | Field Programmable Gate Array, 12084-Cell, PBGA484 | M2GL010-FGG484 vs M2GL010-FGG484 |
| M2GL010-FG484 | Microchip Technology Inc | $44.4135 | Field Programmable Gate Array, 12084-Cell, PBGA484 | M2GL010-FGG484 vs M2GL010-FG484 |
M2GL010-FGG484 Frequently Asked Questions (FAQ)
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Microsemi provides a PCB design guide for the M2GL010-FGG484, which recommends a 4-layer or 6-layer stackup with specific layer assignments and spacing. It's essential to follow these guidelines to ensure signal integrity and minimize electromagnetic interference (EMI).
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Microsemi recommends using an external POR circuit with a voltage supervisor IC, such as the MIC803, to ensure a reliable power-on reset. The POR circuit should be designed to meet the FPGA's power-up sequencing requirements and provide a clean reset signal.
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The M2GL010-FGG484 has a thermal design power (TDP) of 1.5W, and it's essential to implement proper thermal management to prevent overheating. This can be achieved through the use of heat sinks, thermal interfaces, and airflow management. Microsemi provides thermal modeling data to help with thermal design.
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To optimize the clocking architecture, it's essential to use the FPGA's built-in clock management resources, such as the Clock Management Unit (CMU) and the Phase-Locked Loop (PLL). Additionally, careful PCB layout and routing of clock signals can help minimize jitter and skew.
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The M2GL010-FGG484 has built-in security features, such as AES encryption, secure boot, and tamper detection. To implement these features, developers can use Microsemi's Libero SoC design software and the FPGA's security IP cores. Microsemi also provides documentation and application notes on implementing security features.