Part Details for M2GL010-1VF256 by Microsemi Corporation
Results Overview of M2GL010-1VF256 by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
M2GL010-1VF256 Information
M2GL010-1VF256 by Microsemi Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for M2GL010-1VF256
M2GL010-1VF256 CAD Models
M2GL010-1VF256 Part Data Attributes
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M2GL010-1VF256
Microsemi Corporation
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Datasheet
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M2GL010-1VF256
Microsemi Corporation
Field Programmable Gate Array, PBGA256, 14 X 14 MM, 0.80 MM PITCH, VFBGA-256
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | 14 X 14 MM, 0.80 MM PITCH, VFBGA-256 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-PBGA-B256 | |
| Length | 14 mm | |
| Number of Terminals | 256 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA256,16X16,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 240 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Seated Height-Max | 1.56 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Width | 14 mm |
Alternate Parts for M2GL010-1VF256
This table gives cross-reference parts and alternative options found for M2GL010-1VF256. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M2GL010-1VF256, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| M2GL010-1VFG256 | Microchip Technology Inc | $39.1208 | Field Programmable Gate Array, PBGA256 | M2GL010-1VF256 vs M2GL010-1VFG256 |
M2GL010-1VF256 Frequently Asked Questions (FAQ)
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Microsemi provides a reference design guide for the M2GL010-1VF256, which includes recommended PCB layout guidelines for optimal performance, including signal integrity, power integrity, and thermal management.
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The M2GL010-1VF256 has a built-in configuration storage mechanism using the FlashROM. Engineers can use the FlashROM to store configuration data, and Microsemi provides guidelines for implementing a reliable configuration storage mechanism in the device's user guide.
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Microsemi recommends following a specific power-up and power-down sequencing to ensure reliable operation of the M2GL010-1VF256. This includes powering up the device in a specific order, such as powering up the core voltage before the I/O voltage, and powering down the device in the reverse order.
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To optimize the M2GL010-1VF256 for low power consumption, engineers can use various techniques such as clock gating, power gating, and dynamic voltage and frequency scaling. Microsemi provides guidelines for power optimization in the device's user guide and datasheet.
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The M2GL010-1VF256 has a maximum junction temperature of 125°C. Engineers should ensure proper thermal management by providing adequate heat sinking, using thermal interface materials, and following Microsemi's guidelines for thermal management in the device's user guide.