Part Details for M2GL005-VFG256I by Microsemi Corporation
Results Overview of M2GL005-VFG256I by Microsemi Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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M2GL005-VFG256I Information
M2GL005-VFG256I by Microsemi Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for M2GL005-VFG256I
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
54AH7424
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Newark | Ic's |Microsemi M2GL005-VFG256I RoHS: Not Compliant Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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Part Details for M2GL005-VFG256I
M2GL005-VFG256I CAD Models
M2GL005-VFG256I Part Data Attributes
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M2GL005-VFG256I
Microsemi Corporation
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Datasheet
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M2GL005-VFG256I
Microsemi Corporation
Field Programmable Gate Array, PBGA256, 14 X 14 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-256
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | 14 X 14 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Microsemi Corporation | |
| JESD-30 Code | S-PBGA-B256 | |
| Length | 14 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 256 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA256,16X16,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Seated Height-Max | 1.56 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 14 mm |
Alternate Parts for M2GL005-VFG256I
This table gives cross-reference parts and alternative options found for M2GL005-VFG256I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M2GL005-VFG256I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| M2GL005-VFG256I | Microchip Technology Inc | $17.0191 | Field Programmable Gate Array, PBGA256 | M2GL005-VFG256I vs M2GL005-VFG256I |
M2GL005-VFG256I Frequently Asked Questions (FAQ)
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Microsemi provides a PCB design guide for the M2GL005-VFG256I, which includes recommendations for PCB layout, routing, and thermal management. It's essential to follow these guidelines to ensure signal integrity, reduce noise, and prevent thermal issues.
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A reliable POR circuit can be implemented using a voltage supervisor IC, such as the TLV7031, which monitors the power supply voltage and asserts a reset signal to the FPGA when the voltage is below a certain threshold. The FPGA's internal POR circuit can also be used in conjunction with an external voltage supervisor IC.
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To ensure proper clock management, it's essential to follow Microsemi's guidelines for clock domain crossing, clock tree synthesis, and clock gating. Additionally, using the FPGA's built-in clock management resources, such as the Clock Management Unit (CMU), can help simplify clock management and reduce power consumption.
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To optimize power consumption and thermal performance, it's essential to use power-aware design techniques, such as clock gating, voltage scaling, and dynamic voltage and frequency scaling. Additionally, using the FPGA's built-in power management features, such as the Power Management Unit (PMU), can help reduce power consumption and thermal generation.
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Microsemi provides a comprehensive design flow and toolset, including the Libero SoC design software, which includes a RTL compiler, synthesizer, and place-and-route tools. Additionally, third-party tools, such as Mentor Graphics' ModelSim and Synopsys' VCS, can be used for simulation and verification.