Part Details for M29W256GH7AN6E by Micron Technology Inc
Results Overview of M29W256GH7AN6E by Micron Technology Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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M29W256GH7AN6E Information
M29W256GH7AN6E by Micron Technology Inc is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for M29W256GH7AN6E
Part # | Distributor | Description | Stock | Price | Buy | |
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Win Source Electronics | IC FLASH 256MBIT 70NS 56TSOP | 22762 |
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$7.6172 / $11.4253 | Buy Now |
Part Details for M29W256GH7AN6E
M29W256GH7AN6E CAD Models
M29W256GH7AN6E Part Data Attributes
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M29W256GH7AN6E
Micron Technology Inc
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Datasheet
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M29W256GH7AN6E
Micron Technology Inc
Flash, 16MX16, 70ns, PDSO56, TSOP-56
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MICRON TECHNOLOGY INC | |
Part Package Code | TSOP | |
Package Description | TSOP-56 | |
Pin Count | 56 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Samacsys Manufacturer | Micron | |
Access Time-Max | 70 ns | |
Alternate Memory Width | 8 | |
Boot Block | BOTTOM/TOP | |
Command User Interface | YES | |
Common Flash Interface | YES | |
Data Polling | YES | |
JESD-30 Code | R-PDSO-G56 | |
JESD-609 Code | e3 | |
Length | 20 mm | |
Memory Density | 268435456 bit | |
Memory IC Type | FLASH | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Sectors/Size | 256 | |
Number of Terminals | 56 | |
Number of Words | 16777216 words | |
Number of Words Code | 16000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 16MX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP56,.8,20 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Page Size | 8/16 words | |
Parallel/Serial | PARALLEL | |
Programming Voltage | 3 V | |
Qualification Status | Not Qualified | |
Ready/Busy | YES | |
Screening Level | AEC-Q100 | |
Seated Height-Max | 1.2 mm | |
Sector Size | 128K | |
Standby Current-Max | 0.0001 A | |
Supply Current-Max | 0.015 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | DUAL | |
Toggle Bit | YES | |
Type | NOR TYPE | |
Width | 14 mm | |
Write Cycle Time-Max (tWC) | 0.00007 ms |
M29W256GH7AN6E Frequently Asked Questions (FAQ)
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The M29W256GH7AN6E has an operating temperature range of -40°C to 85°C.
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The device requires a power-up sequence of VCC first, then VPP, and a power-down sequence of VPP first, then VCC. This ensures proper device operation and prevents latch-up.
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A 4-layer PCB with a solid ground plane and separate power planes for VCC and VPP is recommended. Route signals away from noise sources and keep signal traces short and direct.
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Use bus buffers or resistors to prevent bus contention, and ensure that the total bus loading does not exceed the recommended capacitance of 100 pF.
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Use 0.1 μF to 1 μF decoupling capacitors placed as close as possible to the device's power pins, with a maximum distance of 1 inch.