Datasheets
M29F200FT55N3E2 by:

Flash, 128KX16, 55ns, PDSO48, 12 X 20 MM, ROHS COMPLIANT, PLASTIC, TSOP1-48

Part Details for M29F200FT55N3E2 by Micron Technology Inc

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M29F200FT55N3E2 Information

M29F200FT55N3E2 by Micron Technology Inc is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Price & Stock for M29F200FT55N3E2

Part # Distributor Description Stock Price Buy
DISTI # M29F200FT55N3E2
Avnet Silica NOR Flash Parallel 5V 2Mbit 256K128K x 8bit16bit 55ns 48Pin TSOP Tray (Alt: M29F200FT55N3E2) RoHS: Compliant Min Qty: 576 Package Multiple: 576 Lead time: 143 Weeks, 0 Days Silica - 0
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DISTI # M29F200FT55N3E2
EBV Elektronik NOR Flash Parallel 5V 2Mbit 256K128K x 8bit16bit 55ns 48Pin TSOP Tray (Alt: M29F200FT55N3E2) RoHS: Compliant Min Qty: 576 Package Multiple: 576 EBV - 0
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Part Details for M29F200FT55N3E2

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M29F200FT55N3E2 Part Data Attributes

M29F200FT55N3E2 Micron Technology Inc
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M29F200FT55N3E2 Micron Technology Inc Flash, 128KX16, 55ns, PDSO48, 12 X 20 MM, ROHS COMPLIANT, PLASTIC, TSOP1-48
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC
Part Package Code TSOP1
Package Description TSOP1-48
Pin Count 48
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 55 ns
Additional Feature TOP BOOT BLOCK
Alternate Memory Width 8
Boot Block TOP
Command User Interface YES
Common Flash Interface YES
Data Polling YES
JESD-30 Code R-PDSO-G48
JESD-609 Code e3
Length 18.4 mm
Memory Density 2097152 bit
Memory IC Type FLASH
Memory Width 16
Number of Functions 1
Number of Sectors/Size 1,2,1,3
Number of Terminals 48
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Organization 128KX16
Package Body Material PLASTIC/EPOXY
Package Code TSOP1
Package Equivalence Code TSSOP48,.8,20
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL
Programming Voltage 5 V
Qualification Status Not Qualified
Ready/Busy YES
Screening Level AEC-Q100
Seated Height-Max 1.2 mm
Sector Size 16K,8K,32K,64K
Standby Current-Max 0.00012 A
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL
Toggle Bit YES
Type NOR TYPE
Width 12 mm

M29F200FT55N3E2 Related Parts

M29F200FT55N3E2 Frequently Asked Questions (FAQ)

  • The M29F200FT55N3E2 has an operating temperature range of -40°C to +85°C.

  • The HOLD# signal should be used to pause the device during a read or write operation, while the OE# signal should be used to tri-state the output buffers during a read operation.

  • The WP# signal is used to prevent accidental writes to the device. When WP# is low, the device is in write-protect mode, and all write operations are inhibited.

  • To perform a sector erase operation, the device must be in the erase suspend mode. Then, the sector address must be written to the device, followed by the erase command (60h).

  • The RP# signal is used to reset the device to its power-on state. When RP# is low, the device is reset, and all internal state machines are reset.

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