Part Details for M27W201-80B6 by STMicroelectronics
Results Overview of M27W201-80B6 by STMicroelectronics
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
M27W201-80B6 Information
M27W201-80B6 by STMicroelectronics is an OTP ROM.
OTP ROMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part Details for M27W201-80B6
M27W201-80B6 CAD Models
M27W201-80B6 Part Data Attributes
|
|
M27W201-80B6
STMicroelectronics
Buy Now
Datasheet
|
Compare Parts:
M27W201-80B6
STMicroelectronics
256KX8 OTPROM, 80ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | DIP | |
| Package Description | 0.600 INCH, PLASTIC, DIP-32 | |
| Pin Count | 32 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 80 ns | |
| Additional Feature | ACCESS TIME 70 NANO SECS AT VCC 3V TO 3.6V | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PDIP-T32 | |
| JESD-609 Code | e3 | |
| Length | 42.035 mm | |
| Memory Density | 2097152 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP32,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 4.83 mm | |
| Standby Current-Max | 0.000015 A | |
| Supply Current-Max | 0.015 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for M27W201-80B6
This table gives cross-reference parts and alternative options found for M27W201-80B6. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M27W201-80B6, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| M27C2001-20F1 | STMicroelectronics | Check for Price | 256KX8 UVPROM, 200ns, CDIP32, LEAD FREE, WINDOWED, FRIT SEALED, CERAMIC, DIP-32 | M27W201-80B6 vs M27C2001-20F1 |
| WMF512K8-120DEQ5A | Mercury Systems Inc | Check for Price | Flash, 512KX8, 120ns, CDSO32, 0.400 INCH, HERMETIC SEALED, CERAMIC, SOJ-32 | M27W201-80B6 vs WMF512K8-120DEQ5A |
| AM27C64-75DC | Rochester Electronics LLC | Check for Price | UVPROM, 8KX8, 70ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | M27W201-80B6 vs AM27C64-75DC |
| AT27C512R-55TI | Atmel Corporation | Check for Price | OTP ROM, 64KX8, 55ns, CMOS, PDSO28, PLASTIC, TSOP-28 | M27W201-80B6 vs AT27C512R-55TI |
| WMF512K8-120FEI5 | Mercury Systems Inc | Check for Price | Flash, 512KX8, 120ns, CDFP32, CERAMIC, DFP-32 | M27W201-80B6 vs WMF512K8-120FEI5 |
| TC58NVG0S3ETA00 | Toshiba America Electronic Components | Check for Price | IC 128M X 8 EEPROM 3V, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48, Programmable ROM | M27W201-80B6 vs TC58NVG0S3ETA00 |
| WMF512K8-150DEQ5A | Mercury Systems Inc | Check for Price | Flash, 512KX8, 150ns, CDSO32, 0.400 INCH, HERMETIC SEALED, CERAMIC, SOJ-32 | M27W201-80B6 vs WMF512K8-150DEQ5A |
| DC2764-25 | LSI Corporation | Check for Price | UVPROM, 8KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | M27W201-80B6 vs DC2764-25 |
| AM27C64-120DIB | Rochester Electronics LLC | Check for Price | UVPROM, 8KX8, 120ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | M27W201-80B6 vs AM27C64-120DIB |
| AM27C64-150DC | Rochester Electronics LLC | Check for Price | UVPROM, 8KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | M27W201-80B6 vs AM27C64-150DC |
M27W201-80B6 Frequently Asked Questions (FAQ)
-
The recommended operating temperature range for the M27W201-80B6 is -40°C to 85°C, but it can tolerate storage temperatures from -65°C to 150°C.
-
The M27W201-80B6 has an internal POR and BOR circuitry. To handle these features, ensure a proper power-up sequence, and use an external capacitor (typically 10nF to 100nF) between the VCC and VSS pins to filter out noise and ensure a clean reset.
-
The M27W201-80B6 can operate at a maximum clock frequency of 80 MHz, but it's recommended to check the specific clock frequency requirements for your application and ensure it's within the device's specifications.
-
To implement a reliable boot process, use a robust boot loader, ensure a proper power-on reset, and implement a watchdog timer to detect and recover from system failures. Additionally, consider using a secure boot mechanism to prevent unauthorized access or code modification.
-
When designing a PCB with the M27W201-80B6, ensure proper decoupling, use a solid ground plane, and keep sensitive signals away from noise sources. Also, follow STMicroelectronics' recommended PCB layout guidelines and consider using a 4-layer PCB to minimize noise and EMI issues.