Part Details for M1A3PE3000L-FG484I by Microsemi Corporation
Results Overview of M1A3PE3000L-FG484I by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Healthcare
M1A3PE3000L-FG484I Information
M1A3PE3000L-FG484I by Microsemi Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for M1A3PE3000L-FG484I
M1A3PE3000L-FG484I CAD Models
M1A3PE3000L-FG484I Part Data Attributes
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M1A3PE3000L-FG484I
Microsemi Corporation
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Datasheet
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M1A3PE3000L-FG484I
Microsemi Corporation
Field Programmable Gate Array, 75264 CLBs, 3000000 Gates, 350MHz, 75264-Cell, CMOS, PBGA484, 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | BGA, BGA484,22X22,40 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Microsemi Corporation | |
| Clock Frequency-Max | 350 MHz | |
| JESD-30 Code | S-PBGA-B484 | |
| JESD-609 Code | e0 | |
| Length | 23 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 75264 | |
| Number of Equivalent Gates | 3000000 | |
| Number of Inputs | 341 | |
| Number of Logic Cells | 75264 | |
| Number of Outputs | 341 | |
| Number of Terminals | 484 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 75264 CLBS, 3000000 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.44 mm | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm |
Alternate Parts for M1A3PE3000L-FG484I
This table gives cross-reference parts and alternative options found for M1A3PE3000L-FG484I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M1A3PE3000L-FG484I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| M1A3PE3000L-FGG484I | Microsemi Corporation | Check for Price | Field Programmable Gate Array, 75264 CLBs, 3000000 Gates, 350MHz, 75264-Cell, CMOS, PBGA484, 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | M1A3PE3000L-FG484I vs M1A3PE3000L-FGG484I |
M1A3PE3000L-FG484I Frequently Asked Questions (FAQ)
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Microsemi provides a PCB design guide and layout recommendations in their documentation, including the 'M1A3PE3000L-FG484I PCB Design Guide' and 'High-Speed PCB Design Considerations' application notes. These resources provide guidance on layer stackup, signal routing, and decoupling capacitor placement.
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Microsemi recommends using their Power Management Guide for the M1A3PE3000L-FG484I, which provides guidance on power supply design, voltage regulation, and power sequencing. Additionally, engineers can use power management ICs (PMICs) specifically designed for FPGAs, such as the Microsemi Power Manager (MPM) series.
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The M1A3PE3000L-FG484I has a maximum junction temperature of 100°C. To prevent overheating, engineers should ensure good airflow, use thermal interface materials (TIMs) between the FPGA and heat sink, and design a heat sink with a thermal resistance of ≤ 1°C/W. Microsemi provides thermal management guidelines in their documentation.
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Microsemi provides a range of security features, including AES encryption, secure boot, and anti-tamper capabilities. Engineers can use these features to protect the FPGA's configuration and implement secure key management practices. Additionally, they can use external security devices, such as secure elements or trusted platform modules (TPMs).
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The M1A3PE3000L-FG484I is a radiation-hardened FPGA designed for space and defense applications. It features a range of radiation-hardened components, including flip-flops, memories, and clocking circuits. Microsemi provides detailed information on the FPGA's radiation hardness in their documentation, including total ionizing dose (TID) and single-event effects (SEE) performance.