Part Details for M1A3P600-2FGG144I by Microchip Technology Inc
Results Overview of M1A3P600-2FGG144I by Microchip Technology Inc
- Distributor Offerings: (9 listings)
- Number of FFF Equivalents: (2 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
M1A3P600-2FGG144I Information
M1A3P600-2FGG144I by Microchip Technology Inc is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for M1A3P600-2FGG144I
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
33AJ7670
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Newark | Proasic3 Fpga, Arm Cortex-M1, 7Kles 144 Lfbga 13X13X1.55Mm Tray Rohs Compliant: Yes |Microchip M1A3P600-2FGG144I RoHS: Compliant Min Qty: 160 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$62.1700 / $69.9500 | Buy Now |
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DISTI #
M1A3P600-2FGG144I-ND
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DigiKey | IC FPGA 97 I/O 144FBGA Min Qty: 160 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
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$69.9502 | Buy Now |
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DISTI #
M1A3P600-2FGG144I
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Avnet Americas | PROASIC3 - Trays (Alt: M1A3P600-2FGG144I) RoHS: Compliant Min Qty: 160 Package Multiple: 160 Lead time: 111 Weeks, 0 Days Container: Tray | 0 |
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$57.6226 / $61.5625 | Buy Now |
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DISTI #
494-M1A3P6002FGG144I
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Mouser Electronics | FPGA - Field Programmable Gate Array ProASIC3 FPGA, ARM Cortex-M1, 7KLEs RoHS: Compliant | 0 |
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$69.9500 | Order Now |
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DISTI #
M1A3P600-2FGG144I
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Microchip Technology Inc | ProASIC3 FPGA, ARM Cortex-M1, 7KLEs, LFBGA, Projected EOL: 2049-02-04 COO: Malaysia ECCN: EAR99 RoHS: Compliant Container: Tray |
296 Alternates Available |
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$34.1800 / $71.0500 | Buy Now |
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Onlinecomponents.com | RoHS: Compliant | 0 |
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$63.0700 / $177.3000 | Buy Now |
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Quest Components | 1024 |
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$387.5000 / $452.0833 | Buy Now | |
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NAC | M1A3P600-2FGG144I RoHS: Compliant Min Qty: 160 Package Multiple: 160 Container: Tray | 0 |
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$60.0600 / $70.3600 | Buy Now |
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Master Electronics | RoHS: Compliant | 0 |
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$63.0700 / $177.3000 | Buy Now |
Part Details for M1A3P600-2FGG144I
M1A3P600-2FGG144I CAD Models
M1A3P600-2FGG144I Part Data Attributes
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M1A3P600-2FGG144I
Microchip Technology Inc
Buy Now
Datasheet
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Compare Parts:
M1A3P600-2FGG144I
Microchip Technology Inc
Field Programmable Gate Array, 13824 CLBs, 600000 Gates, CMOS, PBGA144
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | FBGA-144 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 111 Weeks | |
| Clock Frequency-Max | 350 MHz | |
| JESD-30 Code | S-PBGA-B144 | |
| JESD-609 Code | e1 | |
| Length | 13 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 13824 | |
| Number of Equivalent Gates | 600000 | |
| Number of Inputs | 97 | |
| Number of Outputs | 97 | |
| Number of Terminals | 144 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 13824 CLBS, 600000 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA144,12X12,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Packing Method | TRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.55 mm | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| Supply Voltage-Nom | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 13 mm |
Alternate Parts for M1A3P600-2FGG144I
This table gives cross-reference parts and alternative options found for M1A3P600-2FGG144I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M1A3P600-2FGG144I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| M1A3P600-2FGG144 | Microchip Technology Inc | $69.0007 | Field Programmable Gate Array, 13824 CLBs, 600000 Gates, 350MHz, CMOS, PBGA144 | M1A3P600-2FGG144I vs M1A3P600-2FGG144 |
| M1A3P600-2FG144 | Microchip Technology Inc | $69.0007 | Field Programmable Gate Array, 13824 CLBs, 600000 Gates, 350MHz, CMOS, PBGA144 | M1A3P600-2FGG144I vs M1A3P600-2FG144 |
M1A3P600-2FGG144I Frequently Asked Questions (FAQ)
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Microchip provides a reference design and layout guidelines in the M1A3P600-2FGG144I datasheet and application notes. Additionally, it's recommended to follow general PCB design best practices for high-speed digital circuits, such as using a solid ground plane, minimizing signal trace lengths, and using thermal vias to dissipate heat.
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The M1A3P600-2FGG144I has various power-saving features, such as dynamic voltage and frequency scaling, and power gating. Engineers can use the Microchip MPLAB X IDE and the device's configuration bits to optimize power consumption for their specific application. Additionally, they can use the device's built-in power management features, such as the Power Management Controller (PMC), to reduce power consumption.
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The M1A3P600-2FGG144I's high-speed interfaces require careful signal integrity analysis, impedance matching, and layout consideration to ensure reliable operation. Engineers should follow the datasheet guidelines and application notes for signal routing, termination, and clocking. Additionally, they should consider the device's power consumption and thermal management when operating at high speeds.
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The M1A3P600-2FGG144I has a boot process that involves loading firmware from external memory. Engineers should ensure that the boot process is properly configured, and the firmware is correctly formatted and stored in the external memory. Additionally, they should implement a secure firmware update mechanism, such as using secure boot and encryption, to prevent unauthorized access and ensure the integrity of the firmware.
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The M1A3P600-2FGG144I's cryptographic accelerators and security features, such as the TrustZone and Secure Boot, require careful configuration and implementation to ensure the security and integrity of the system. Engineers should follow the datasheet guidelines and application notes for configuring and using these features, and consider implementing additional security measures, such as secure key storage and access control.