Part Details for LTM2881HY-3 by Linear Technology
Results Overview of LTM2881HY-3 by Linear Technology
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Energy and Power Systems
Healthcare
Transportation and Logistics
Renewable Energy
Telecommunications
Automotive
LTM2881HY-3 Information
LTM2881HY-3 by Linear Technology is a Line Driver or Receiver.
Line Driver or Receivers are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Price & Stock for LTM2881HY-3
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Interface ICs | 1391 |
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RFQ |
Part Details for LTM2881HY-3
LTM2881HY-3 CAD Models
LTM2881HY-3 Part Data Attributes
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LTM2881HY-3
Linear Technology
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Datasheet
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LTM2881HY-3
Linear Technology
LTM2881 - Complete Isolated RS485/RS422 µModule Transceiver + Power; Package: BGA; Pins: 32; Temperature Range: -40°C to 125°C
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | LINEAR TECHNOLOGY CORP | |
| Part Package Code | BGA | |
| Package Description | BGA-32 | |
| Pin Count | 32 | |
| Manufacturer Package Code | BGA | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Differential Output | YES | |
| Driver Number of Bits | 1 | |
| Input Characteristics | DIFFERENTIAL SCHMITT TRIGGER | |
| Interface IC Type | LINE TRANSCEIVER | |
| Interface Standard | EIA-485-A; TIA-485-A; EIA-422 | |
| JESD-30 Code | R-PBGA-B32 | |
| JESD-609 Code | e0 | |
| Length | 15 mm | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Receive Delay-Max | 140 ns | |
| Receiver Number of Bits | 1 | |
| Seated Height-Max | 3.62 mm | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 1.62 V | |
| Supply Voltage-Nom | 3.3 V | |
| Supply Voltage1-Max | 3.6 V | |
| Supply Voltage1-Min | 3 V | |
| Supply Voltage1-Nom | 3.3 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Transmit Delay-Max | 1550 ns | |
| Width | 11.25 mm |
LTM2881HY-3 Frequently Asked Questions (FAQ)
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A good PCB layout for the LTM2881HY-3 involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated layer for the analog signals.
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To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive PCB material, and keeping the device away from heat sources. Additionally, the device should be operated within its specified temperature range.
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Operating the LTM2881HY-3 at a lower input voltage than the recommended 3.3V may result in reduced performance, increased power consumption, and potential instability. Operating at a higher input voltage may result in increased power consumption, heat generation, and potentially damage the device. It's recommended to operate the device within the specified input voltage range.
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To troubleshoot issues with the I2C interface, check the I2C bus voltage levels, ensure proper termination, and verify that the clock frequency is within the specified range. Additionally, use an oscilloscope to monitor the I2C bus signals and check for any bus contention or noise issues.
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To minimize EMI and RFI issues, use a shielded enclosure, keep the device away from radiating sources, and use a low-pass filter on the input power lines. Additionally, ensure that the PCB layout is designed to minimize radiation and that the device is operated within its specified frequency range.