Part Details for LTC2862AHDD-1#PBF by Linear Technology
Results Overview of LTC2862AHDD-1#PBF by Linear Technology
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
LTC2862AHDD-1#PBF Information
LTC2862AHDD-1#PBF by Linear Technology is a Line Driver or Receiver.
Line Driver or Receivers are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Part Details for LTC2862AHDD-1#PBF
LTC2862AHDD-1#PBF CAD Models
LTC2862AHDD-1#PBF Part Data Attributes
|
LTC2862AHDD-1#PBF
Linear Technology
Buy Now
Datasheet
|
Compare Parts:
LTC2862AHDD-1#PBF
Linear Technology
LTC2862A - ±60V Fault Protected 3V to 5.5V RS485/RS422 Transceiver with Level 4 IEC ESD; Package: DFN; Pins: 8; Temperature Range: -40°C to 125°C
|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | LINEAR TECHNOLOGY CORP | |
Part Package Code | DFN | |
Package Description | DFN-8 | |
Pin Count | 8 | |
Manufacturer Package Code | DD | |
Reach Compliance Code | compliant | |
Date Of Intro | 2017-06-06 | |
Differential Output | YES | |
Driver Number of Bits | 1 | |
Input Characteristics | DIFFERENTIAL SCHMITT TRIGGER | |
Interface IC Type | LINE TRANSCEIVER | |
Interface Standard | EIA-422; EIA-485 | |
JESD-30 Code | S-PDSO-N8 | |
JESD-609 Code | e3 | |
Length | 3 mm | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HVSON | |
Package Shape | SQUARE | |
Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Receive Delay-Max | 65 ns | |
Receiver Number of Bits | 1 | |
Seated Height-Max | 0.8 mm | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | BICMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Transmit Delay-Max | 50 ns | |
Width | 3 mm |
LTC2862AHDD-1#PBF Frequently Asked Questions (FAQ)
-
The recommended PCB layout for the LTC2862AHDD-1#PBF involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated layer for the analog signals to minimize noise and interference.
-
The LTC2862AHDD-1#PBF requires a single 3.3V or 5V power supply. It's recommended to power the device with a low noise, low dropout regulator. The power sequencing requirements involve powering the device after the analog supply is stable, and ensuring that the digital supply is powered after the analog supply.
-
The maximum data rate that can be achieved with the LTC2862AHDD-1#PBF is 100Mbps. However, the actual data rate may vary depending on the specific application, PCB layout, and noise environment.
-
The LTC2862AHDD-1#PBF can be configured for half-duplex or full-duplex operation by setting the appropriate pins. For half-duplex operation, the TXEN pin should be tied to the RXEN pin. For full-duplex operation, the TXEN pin should be tied to VCC and the RXEN pin should be tied to GND.
-
The LTC2862AHDD-1#PBF is a high-speed device and requires proper EMI and RFI considerations. This includes using a shielded cable, minimizing loop areas, and using a common mode choke to reduce emissions. Additionally, the device should be placed in a shielded enclosure to reduce radiated emissions.