Datasheets
LTC2626CDD-1#PBF by:

LTC2626 - 12-Bit Rail-to-Rail DACs with I<sup>2</sup>C Interface; Package: DFN; Pins: 10; Temperature Range: 0&deg;C to 70&deg;C

Part Details for LTC2626CDD-1#PBF by Linear Technology

Results Overview of LTC2626CDD-1#PBF by Linear Technology

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

LTC2626CDD-1#PBF Information

LTC2626CDD-1#PBF by Linear Technology is a Digital to Analog Converter.
Digital to Analog Converters are under the broader part category of Converters.

A converter is an electrical circuit that transforms electric energy into a different form that will support a elecrical load needed by a device. Read more about Converters on our Converters part category page.

Price & Stock for LTC2626CDD-1#PBF

Part # Distributor Description Stock Price Buy
Vyrian Converters 245
RFQ

Part Details for LTC2626CDD-1#PBF

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LTC2626CDD-1#PBF Part Data Attributes

LTC2626CDD-1#PBF Linear Technology
Buy Now Datasheet
Compare Parts:
LTC2626CDD-1#PBF Linear Technology LTC2626 - 12-Bit Rail-to-Rail DACs with I<sup>2</sup>C Interface; Package: DFN; Pins: 10; Temperature Range: 0&deg;C to 70&deg;C
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer LINEAR TECHNOLOGY CORP
Part Package Code DFN
Package Description DFN-10
Pin Count 10
Manufacturer Package Code DD
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Analog Output Voltage-Max 5.5 V
Analog Output Voltage-Min
Converter Type D/A CONVERTER
Input Bit Code BINARY
Input Format SERIAL
JESD-30 Code S-PDSO-N10
JESD-609 Code e3
Length 3 mm
Linearity Error-Max (EL) 0.0977%
Moisture Sensitivity Level 1
Number of Bits 12
Number of Functions 1
Number of Terminals 10
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY
Package Code HVSON
Package Equivalence Code SOLCC10,.11,20
Package Shape SQUARE
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 0.8 mm
Settling Time-Nom (tstl) 7 µs
Supply Current-Max 0.5 mA
Supply Voltage-Nom 3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Matte Tin (Sn)
Terminal Form NO LEAD
Terminal Pitch 0.5 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3 mm

LTC2626CDD-1#PBF Frequently Asked Questions (FAQ)

  • The recommended layout and placement for the LTC2626CDD-1#PBF involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, it's recommended to use a low-ESR capacitor for the VCC pin and to keep the input and output traces short and away from noise sources.

  • To ensure the LTC2626CDD-1#PBF operates within its specified temperature range, it's essential to provide adequate heat sinking, especially in high-power applications. The device should be mounted on a PCB with a thermal pad, and a heat sink can be added if necessary. Additionally, the ambient temperature should be monitored to ensure it stays within the specified range of -40°C to 125°C.

  • Potential sources of error in the LTC2626CDD-1#PBF include noise, thermal effects, and component tolerances. To minimize these errors, it's essential to use a low-noise power supply, ensure good thermal management, and use high-precision external components. Additionally, the device should be calibrated regularly to ensure accuracy.

  • To troubleshoot issues with the LTC2626CDD-1#PBF, start by checking the power supply voltage, input voltage, and output voltage to ensure they are within the specified ranges. Verify that the device is properly configured and that the external components are correct. Use an oscilloscope to check for oscillations or noise on the output, and consult the datasheet and application notes for guidance on troubleshooting specific issues.

  • The LTC2626CDD-1#PBF can be used in high-reliability or safety-critical applications, but additional considerations are necessary. These include ensuring the device is operated within its specified temperature range, using redundant or fault-tolerant designs, and implementing error detection and correction mechanisms. Additionally, the device should be qualified and tested according to the relevant industry standards, such as automotive or aerospace standards.

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