Datasheets
LTC2621IDD-1#PBF by:

LTC2621 - 12-Bit Rail-to-Rail DACs in 10-Lead DFN; Package: DFN; Pins: 10; Temperature Range: -40°C to 85°C

Part Details for LTC2621IDD-1#PBF by Linear Technology

Results Overview of LTC2621IDD-1#PBF by Linear Technology

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Applications Industrial Automation Renewable Energy Robotics and Drones

LTC2621IDD-1#PBF Information

LTC2621IDD-1#PBF by Linear Technology is a Digital to Analog Converter.
Digital to Analog Converters are under the broader part category of Converters.

A converter is an electrical circuit that transforms electric energy into a different form that will support a elecrical load needed by a device. Read more about Converters on our Converters part category page.

Price & Stock for LTC2621IDD-1#PBF

Part # Distributor Description Stock Price Buy
Vyrian Converters 1188
RFQ

Part Details for LTC2621IDD-1#PBF

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LTC2621IDD-1#PBF Part Data Attributes

LTC2621IDD-1#PBF Linear Technology
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LTC2621IDD-1#PBF Linear Technology LTC2621 - 12-Bit Rail-to-Rail DACs in 10-Lead DFN; Package: DFN; Pins: 10; Temperature Range: -40°C to 85°C
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer LINEAR TECHNOLOGY CORP
Part Package Code DFN
Package Description 3 X 3 MM, LEAD FREE, PLASTIC, MO-229WEED-2, DFN-10
Pin Count 10
Manufacturer Package Code DD
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Analog Output Voltage-Max 5.5 V
Analog Output Voltage-Min
Converter Type D/A CONVERTER
Input Bit Code BINARY
Input Format SERIAL
JESD-30 Code S-PDSO-N10
JESD-609 Code e3
Length 3 mm
Linearity Error-Max (EL) 0.0977%
Moisture Sensitivity Level 1
Number of Bits 12
Number of Functions 1
Number of Terminals 10
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code HVSON
Package Equivalence Code SOLCC10,.11,20
Package Shape SQUARE
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 0.8 mm
Settling Time-Nom (tstl) 7 µs
Supply Current-Max 0.55 mA
Supply Voltage-Nom 3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Matte Tin (Sn)
Terminal Form NO LEAD
Terminal Pitch 0.5 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3 mm

Alternate Parts for LTC2621IDD-1#PBF

This table gives cross-reference parts and alternative options found for LTC2621IDD-1#PBF. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LTC2621IDD-1#PBF, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
LTC2621IDD-1 Analog Devices Inc Check for Price D/A Converter, 1 Func, Serial Input Loading, 7us Settling Time, PDSO10 LTC2621IDD-1#PBF vs LTC2621IDD-1
LTC2621IDD-1#PBF Analog Devices Inc Check for Price 12-Bit Rail-to-Rail DACs in 10-Lead DFN LTC2621IDD-1#PBF vs LTC2621IDD-1#PBF
LTC2621IDD-1 Linear Technology Check for Price LTC2621 - 12-Bit Rail-to-Rail DACs in 10-Lead DFN; Package: DFN; Pins: 10; Temperature Range: -40°C to 85°C LTC2621IDD-1#PBF vs LTC2621IDD-1

LTC2621IDD-1#PBF Frequently Asked Questions (FAQ)

  • The datasheet provides some general guidelines, but a good rule of thumb is to keep the analog and digital grounds separate, use a solid ground plane, and place the device close to the analog signal sources. Additionally, keep the input and output traces short and away from digital signals. A 4-layer PCB with a dedicated analog ground layer is recommended.

  • The datasheet provides a calibration procedure, but it's essential to follow the recommended sequence and timing. Additionally, consider using the LTspice simulation tool to model and optimize your design before prototyping. You can also consult the Linear Technology application notes and design notes for specific guidance on calibration and configuration.

  • The datasheet provides thermal resistance and junction-to-case thermal resistance values. To ensure the device doesn't overheat, consider using a heat sink, especially if you're operating at high frequencies or with high-power signals. Keep the device away from other heat sources, and ensure good airflow around the PCB. You can also use thermal simulation tools to model and optimize your design.

  • Start by reviewing the datasheet and application notes to ensure you've followed the recommended design and layout guidelines. Use an oscilloscope to visualize the input and output signals, and check for any signs of noise or distortion. Consult the Linear Technology troubleshooting guides and FAQs, and consider seeking support from their technical support team or online forums.

  • Yes, the LTC2621IDD-1#PBF is a high-frequency device, and EMI/EMC considerations are crucial. Ensure you follow proper shielding and grounding techniques, and use EMI filters or chokes as needed. Keep the device away from other noise-sensitive components, and consider using a metal shield or enclosure to reduce radiated emissions. Consult the Linear Technology application notes and EMI/EMC guidelines for specific guidance.

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