Part Details for LSM303AGR by STMicroelectronics
Results Overview of LSM303AGR by STMicroelectronics
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
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LSM303AGR Information
LSM303AGR by STMicroelectronics is an Other Signal Circuit.
Other Signal Circuits are under the broader part category of Signal Circuits.
A signal is an electronic means of transmitting information, either as an analog signal with continuous values or a digital signal with discrete values. Signals are used in various systems and networks. Read more about Signal Circuits on our Signal Circuits part category page.
Price & Stock for LSM303AGR
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
LSM303AGR
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Avnet Americas | Ultra-compact high-performance eCompass IC (accelerometer & magnetometer) - Trays (Alt: LSM303AGR) RoHS: Compliant Min Qty: 2940 Package Multiple: 2940 Lead time: 111 Weeks, 0 Days Container: Tray | 0 |
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RFQ | |
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DISTI #
LSM303AGR
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Avnet Silica | Ultracompact highperformance eCompass IC accelerometer magnetometer (Alt: LSM303AGR) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 143 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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Cytech Systems Limited | 5262 |
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RFQ | ||
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Vyrian | Other Function Semiconductors | 1200 |
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RFQ | |
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Win Source Electronics | IMUs Inertial Measurement Units CONSUME MEMS | 16195 |
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$1.1667 / $1.5070 | Buy Now |
Part Details for LSM303AGR
LSM303AGR CAD Models
LSM303AGR Part Data Attributes
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LSM303AGR
STMicroelectronics
Buy Now
Datasheet
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LSM303AGR
STMicroelectronics
Ultra-compact high-performance eCompass module: ultra-low power 3D accelerometer and 3D magnetometer
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Package Description | LGA-12 | |
| Manufacturer Package Code | LGA 2X2X1 12LD PITCH 0.5MM | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 111 Weeks | |
| Samacsys Manufacturer | STMicroelectronics | |
| Analog IC - Other Type | ANALOG CIRCUIT | |
| JESD-30 Code | S-PBGA-B12 | |
| JESD-609 Code | e4 | |
| Length | 2 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 12 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFLGA | |
| Package Equivalence Code | LCC12,.08SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 1.71 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
| Terminal Form | BUTT | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 2 mm |
Alternate Parts for LSM303AGR
This table gives cross-reference parts and alternative options found for LSM303AGR. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LSM303AGR, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| LSM303AGRTR | STMicroelectronics | $3.8721 | Ultra-compact high-performance eCompass module: ultra-low power 3D accelerometer and 3D magnetometer | LSM303AGR vs LSM303AGRTR |
Resources and Additional Insights for LSM303AGR
Reference Designs related to LSM303AGR
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IO-Link for Industrial Sensors
This self-contained and ready-to-use modern industrial sensor solution implements multi-sensing functionality with embedded LSM6DSL 3D accelerometer and 3D gyroscope, LSM303AGR 3D accelerometer and 3D magnetometer, LPS22HB pressure sensor, and HTS221 humidity and temperature sensors, along with the L6362A physical IO-Link transceiver and STM32L073RZT6 microcontroller hosting the relevant protocol stack.<p>The node complies with the definition of an IO-Link device according to the provisioning protocols defined by the standard and facilitates expansion with additional sensors to extend the range of data supplied by the node.<p>The architecture represents a smart sensor node capable of monitoring equipment status, with all the benefits of the IO-Link industrial communication standard, including automatic node configuration, hot plug automatic device recognition, and several diagnostics features
LSM303AGR Frequently Asked Questions (FAQ)
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The recommended power-on sequence is to power up the accelerometer first, followed by the magnetometer. This ensures that the magnetometer is not affected by the accelerometer's power-on reset.
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The interrupt signals from the LSM303AGR are active-low and open-drain. This means that an external pull-up resistor is required to connect the interrupt pin to the microcontroller's GPIO pin.
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The temperature sensor in the LSM303AGR is used to compensate for temperature-related drift in the accelerometer and magnetometer measurements. It is not intended for use as a standalone temperature sensor.
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Yes, the LSM303AGR is designed to operate in high-vibration environments. However, it's recommended to use a low-pass filter to remove high-frequency noise and ensure accurate measurements.
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The magnetometer in the LSM303AGR requires calibration to compensate for hard-iron and soft-iron effects. This can be done using a calibration algorithm that involves rotating the device in a magnetic field.