Part Details for LS1021ASN7HNB by NXP Semiconductors
Results Overview of LS1021ASN7HNB by NXP Semiconductors
- Distributor Offerings: (9 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Telecommunications
LS1021ASN7HNB Information
LS1021ASN7HNB by NXP Semiconductors is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for LS1021ASN7HNB
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
51Y5384
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Newark | Layerscape 32-Bit Arm Cortex-A7, Dual-Core, 800Mhz, 0 To 105C, Security Disabled/ Tray Rohs Compliant: Yes |Nxp LS1021ASN7HNB RoHS: Compliant Min Qty: 84 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$38.3700 / $40.7100 | Buy Now |
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DISTI #
2832-LS1021ASN7HNB-ND
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DigiKey | IC MPU QORIQ 800MHZ 525FCPBGA Min Qty: 20 Lead time: 18 Weeks Container: Tray MARKETPLACE PRODUCT |
347 In Stock |
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$39.0400 | Buy Now |
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DISTI #
568-14613-ND
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DigiKey | IC MPU QORIQ 800MHZ 525FCPBGA Min Qty: 20 Lead time: 18 Weeks Container: Tray | Temporarily Out of Stock |
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$41.7585 | Buy Now |
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DISTI #
LS1021ASN7HNB
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Avnet Americas | Communication Processor 525-Pin FCBGA Box - Trays (Alt: LS1021ASN7HNB) RoHS: Compliant Min Qty: 18 Package Multiple: 1 Lead time: 0 Weeks, 2 Days Container: Tray | 347 Partner Stock |
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$36.8352 / $37.6026 | Buy Now |
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DISTI #
LS1021ASN7HNB
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Avnet Americas | Communication Processor 525-Pin FCBGA Box - Trays (Alt: LS1021ASN7HNB) RoHS: Compliant Min Qty: 168 Package Multiple: 84 Lead time: 18 Weeks, 0 Days Container: Tray | 0 |
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$36.8352 / $37.6026 | Buy Now |
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DISTI #
841-LS1021ASN7HNB
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Mouser Electronics | Microprocessors - MPU Layerscape 32-bit Arm Cortex-A7, Dual-core, 800MHz, 0 to 105C, Security disabled RoHS: Compliant | 0 |
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$39.9800 / $54.9200 | Order Now |
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DISTI #
LS1021ASN7HNB
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Avnet Silica | Communication Processor 525Pin FCBGA Box (Alt: LS1021ASN7HNB) RoHS: Compliant Min Qty: 84 Package Multiple: 84 Lead time: 20 Weeks, 0 Days | Silica - 1680 |
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Buy Now | |
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DISTI #
LS1021ASN7HNB
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EBV Elektronik | Communication Processor 525Pin FCBGA Box (Alt: LS1021ASN7HNB) RoHS: Compliant Min Qty: 84 Package Multiple: 84 Lead time: 20 Weeks, 0 Days | EBV - 0 |
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Buy Now | |
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Flip Electronics | Stock, ship today | 347 |
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RFQ |
Part Details for LS1021ASN7HNB
LS1021ASN7HNB CAD Models
LS1021ASN7HNB Part Data Attributes
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LS1021ASN7HNB
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
LS1021ASN7HNB
NXP Semiconductors
SPECIALTY MICROPROCESSOR CIRCUIT, PBGA525
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | 19 X 19 MM, 1.92 HEIGHT, PLASTIC, FCBGA-525 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.1 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 18 Weeks | |
| Samacsys Manufacturer | NXP | |
| JESD-30 Code | S-PBGA-B525 | |
| JESD-609 Code | e1 | |
| Length | 19 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 525 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 2.07 mm | |
| Supply Voltage-Max | 1.03 V | |
| Supply Voltage-Min | 0.97 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 19 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
LS1021ASN7HNB Frequently Asked Questions (FAQ)
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NXP provides a recommended PCB layout guide for the LS1021ASN7HNB in the 'LS1021A Series PCB Design Guidelines' document, which can be found on the NXP website. This guide provides detailed information on component placement, routing, and thermal management to ensure optimal performance and reliability.
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To optimize power consumption, it's essential to understand the power modes and states of the LS1021ASN7HNB. NXP provides a 'Power Management Guide' document that explains how to use the various power modes, such as low-power modes, sleep modes, and dynamic voltage and frequency scaling (DVFS). Additionally, optimizing the system's clock frequency, using power gating, and minimizing idle time can also help reduce power consumption.
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The LS1021ASN7HNB has a maximum junction temperature (Tj) of 105°C. To ensure reliable operation, it's essential to implement proper thermal management. This includes using a heat sink, thermal interface material, and ensuring good airflow around the device. NXP provides thermal modeling and simulation tools to help designers estimate the device's thermal performance and optimize their design accordingly.
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The LS1021ASN7HNB has built-in security features, such as a secure boot mechanism, trusted execution environment (TEE), and cryptographic accelerators. To secure your system, it's essential to implement secure boot, use secure protocols for communication, and encrypt sensitive data. NXP provides a 'Security Guide' document that explains how to use these features and provides recommendations for securing your system.
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NXP provides a range of development tools and software for the LS1021ASN7HNB, including the LS1021A Tower System, CodeWarrior Development Studio, and the Yocto Project-based Linux BSP. Additionally, NXP partners with third-party vendors to provide a range of development tools, such as IAR Embedded Workbench and Keil µVision.