Part Details for LPC1759FBD80 by NXP Semiconductors
Results Overview of LPC1759FBD80 by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Healthcare
Renewable Energy
Robotics and Drones
LPC1759FBD80 Information
LPC1759FBD80 by NXP Semiconductors is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for LPC1759FBD80
| Part # | Distributor | Description | Stock | Price | Buy | |
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Win Source Electronics | IC MCU 32BIT 512KB FLASH 80LQFP | 5500 |
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$6.7376 / $8.7026 | Buy Now |
Part Details for LPC1759FBD80
LPC1759FBD80 CAD Models
LPC1759FBD80 Part Data Attributes
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LPC1759FBD80
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
LPC1759FBD80
NXP Semiconductors
32-BIT, FLASH, 120MHz, RISC MICROCONTROLLER, PQFP80, 12 X 12 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT315-1, 80 PIN
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | QFP | |
| Pin Count | 80 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| CPU Family | CORTEX-M3 | |
| Clock Frequency-Max | 25 MHz | |
| DAC Channels | YES | |
| DMA Channels | YES | |
| External Data Bus Width | ||
| JESD-30 Code | S-PQFP-G80 | |
| JESD-609 Code | e3 | |
| Length | 12 mm | |
| Moisture Sensitivity Level | 2 | |
| Number of I/O Lines | 52 | |
| Number of Terminals | 80 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 65536 | |
| ROM (words) | 524288 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.6 mm | |
| Speed | 120 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3.3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 12 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
Alternate Parts for LPC1759FBD80
This table gives cross-reference parts and alternative options found for LPC1759FBD80. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LPC1759FBD80, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| LPC1759FBD80,551 | NXP Semiconductors | $7.0980 | LPC1759FBD80 - 512kB flash, 64kB SRAM, USB, LQFP80 package QFP 80-Pin | LPC1759FBD80 vs LPC1759FBD80,551 |
| LPC1759FBD80Y | NXP Semiconductors | Check for Price | RISC Microcontroller | LPC1759FBD80 vs LPC1759FBD80Y |
LPC1759FBD80 Frequently Asked Questions (FAQ)
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The maximum operating temperature range for the LPC1759FBD80 is -40°C to +105°C, but this can be extended to -40°C to +125°C for some specific packages and with certain limitations.
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The clock settings for the LPC1759FBD80 can be configured using the Clock Generation Unit (CGU) and the Power Management Unit (PMU). The CGU generates the clock signals for the CPU, peripherals, and other components, while the PMU controls the power modes and clock frequencies. The configuration is typically done using registers and can be found in the user manual and application notes.
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The maximum current consumption of the LPC1759FBD80 depends on the operating frequency, voltage, and peripherals used. According to the datasheet, the typical current consumption is around 130 mA at 100 MHz and 3.3V, but this can increase to around 250 mA at 200 MHz and 3.3V. It's recommended to consult the datasheet and application notes for more detailed information.
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The LPC1759FBD80 has a USB 2.0 full-speed device controller that can be used for communication with a host device. To use the USB interface, you need to configure the USB registers, enable the USB clock, and implement the USB protocol stack. NXP provides a USB stack and example code in their software development kits (SDKs) and application notes.
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The LPC1759FBD80 has 512 KB of flash memory, but not all of it can be used for code storage. The boot loader and other system functions occupy some of the flash memory, leaving around 450 KB available for user code.