Part Details for LPC1346FHN33,551 by NXP Semiconductors
Results Overview of LPC1346FHN33,551 by NXP Semiconductors
- Distributor Offerings: (9 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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LPC1346FHN33,551 Information
LPC1346FHN33,551 by NXP Semiconductors is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for LPC1346FHN33,551
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
90T5857
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Newark | Entry-Level 32-Bit Microcontroller (Mcu) Based On Arm Cortex-M3 Core/ Tray Rohs Compliant: Yes |Nxp LPC1346FHN33,551 RoHS: Compliant Min Qty: 260 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$4.1800 / $4.3000 | Buy Now |
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DISTI #
2156-LPC1346FHN33,551-ND
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DigiKey | IC MCU 32BIT 48KB FLASH 32HVQFN Min Qty: 72 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
284 In Stock |
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$4.2000 | Buy Now |
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DISTI #
LPC1346FHN33,551-ND
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DigiKey | IC MCU 32BIT 48KB FLASH 32HVQFN Min Qty: 260 Lead time: 13 Weeks Container: Tray | Temporarily Out of Stock |
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$4.4731 | Buy Now |
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DISTI #
LPC1346FHN33,551
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Avnet Americas | MCU 32-bit LPC1300 ARM Cortex M3 RISC 48KB Flash 2.5V/3.3V 33-Pin HVQFN EP Tray - Trays (Alt: LPC1346FHN33,551) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
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$3.5014 / $4.1157 | Buy Now |
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DISTI #
771-LPC1346FHN33,551
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Mouser Electronics | ARM Microcontrollers - MCU 32bit ARM Cortex-M3 48KB Flash 10KB SRAM RoHS: Compliant | 0 |
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$4.1900 / $4.4800 | Order Now |
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Rochester Electronics | LPC1346 - 32-bit Microcontroller (MCU) based on ARM Cortex-M3 Core RoHS: Compliant Status: Active Min Qty: 1 | 284 |
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$3.2300 / $4.0400 | Buy Now |
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DISTI #
LPC1346FHN33,551
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Avnet Silica | MCU 32bit LPC1300 ARM Cortex M3 RISC 48KB Flash 25V33V 33Pin HVQFN EP Tray (Alt: LPC1346FHN33,551) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 15 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
LPC1346FHN33,551
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EBV Elektronik | MCU 32bit LPC1300 ARM Cortex M3 RISC 48KB Flash 25V33V 33Pin HVQFN EP Tray (Alt: LPC1346FHN33,551) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 15 Weeks, 0 Days | EBV - 0 |
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Buy Now | |
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Flip Electronics | Stock | 13000 |
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RFQ |
Part Details for LPC1346FHN33,551
LPC1346FHN33,551 CAD Models
LPC1346FHN33,551 Part Data Attributes
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LPC1346FHN33,551
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
LPC1346FHN33,551
NXP Semiconductors
LPC1346FHN33 - 48kB Flash, 10kB SRAM, USB Device QFN 32-Pin
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | QFN | |
| Package Description | 7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33 | |
| Pin Count | 32 | |
| Manufacturer Package Code | SOT865-3 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 13 Weeks | |
| Samacsys Manufacturer | NXP | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| CPU Family | CORTEX-M3 | |
| Clock Frequency-Max | 25 MHz | |
| DAC Channels | NO | |
| DMA Channels | NO | |
| External Data Bus Width | ||
| JESD-30 Code | S-PQCC-N33 | |
| Length | 7 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 26 | |
| Number of Terminals | 33 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVQCCN | |
| Package Equivalence Code | LCC32,.27SQ,25 | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 8192 | |
| ROM (words) | 49152 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1 mm | |
| Speed | 72 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3.3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 7 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
LPC1346FHN33,551 Frequently Asked Questions (FAQ)
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The maximum operating temperature range for the LPC1346FHN33,551 is -40°C to +85°C.
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The clock settings for the LPC1346FHN33,551 can be configured using the Clock Generation Unit (CGU) registers. The CGU provides a flexible clock generation system that allows the user to configure the clock sources, dividers, and multipliers to generate the desired clock frequencies.
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The maximum current consumption of the LPC1346FHN33,551 depends on the operating frequency and voltage. According to the datasheet, the maximum current consumption is approximately 130 mA at 48 MHz and 3.3V.
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The LPC1346FHN33,551 has a USB 2.0 full-speed device controller that can be used to implement USB device functionality. The USB interface can be configured using the USB registers and the USB library provided by NXP Semiconductors.
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The maximum flash memory endurance of the LPC1346FHN33,551 is 100,000 program/erase cycles.