Datasheets
LPC11U68JBD100 by:

IC RISC MICROCONTROLLER, Microcontroller

Part Details for LPC11U68JBD100 by NXP Semiconductors

Results Overview of LPC11U68JBD100 by NXP Semiconductors

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Applications Consumer Electronics Internet of Things (IoT) Smart Cities

LPC11U68JBD100 Information

LPC11U68JBD100 by NXP Semiconductors is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for LPC11U68JBD100

Part # Distributor Description Stock Price Buy
Vyrian Peripheral ICs 616
RFQ

Part Details for LPC11U68JBD100

LPC11U68JBD100 CAD Models

LPC11U68JBD100 Part Data Attributes

LPC11U68JBD100 NXP Semiconductors
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LPC11U68JBD100 NXP Semiconductors IC RISC MICROCONTROLLER, Microcontroller
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description LQFP100
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Samacsys Manufacturer NXP
Has ADC YES
Address Bus Width
Bit Size 32
Boundary Scan YES
CPU Family CORTEX-M0
Clock Frequency-Max 25 MHz
DAC Channels NO
DMA Channels YES
External Data Bus Width
Format FIXED POINT
Integrated Cache YES
JESD-30 Code S-PQFP-G100
JESD-609 Code e3
Length 14 mm
Low Power Mode YES
Moisture Sensitivity Level 3
Number of DMA Channels 16
Number of External Interrupts 8
Number of I/O Lines 80
Number of Serial I/Os 5
Number of Terminals 100
Number of Timers 7
On Chip Data RAM Width 8
On Chip Program ROM Width 8
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code LFQFP
Package Equivalence Code QFP100,.63SQ,20
Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
RAM (bytes) 36864
ROM (words) 262144
ROM Programmability FLASH
Seated Height-Max 1.6 mm
Speed 50 MHz
Supply Current-Max 100 mA
Supply Voltage-Max 3.6 V
Supply Voltage-Min 2.4 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 14 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC

LPC11U68JBD100 Related Parts

LPC11U68JBD100 Frequently Asked Questions (FAQ)

  • The internal oscillator can be configured to run up to 12 MHz, but the maximum clock frequency that can be achieved depends on the specific configuration and the quality of the external crystal used. Typically, it can reach up to 10 MHz.

  • To configure the USB interface to work in device mode, you need to set the USB_MODE pin high, enable the USB clock, and configure the USB registers to enable device mode. You can refer to the USB chapter in the user manual for more details.

  • The maximum amount of current that can be sourced or sunk by the GPIO pins is 4 mA per pin, with a total current limit of 100 mA for all GPIO pins combined.

  • To use the ADC, you need to configure the ADC clock, select the ADC channel, set the ADC resolution, and start the ADC conversion. You can then read the converted digital value from the ADC result register. Refer to the ADC chapter in the user manual for more details.

  • The BOOT pin is used to select the boot mode of the microcontroller. When the BOOT pin is pulled low, the microcontroller boots from the internal flash memory. When it is pulled high, the microcontroller boots from the external memory or serial interface. You can use the BOOT pin to select the boot mode depending on your application requirements.

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