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Part Details for LM3S1439-IBZ50-A2 by Texas Instruments
Results Overview of LM3S1439-IBZ50-A2 by Texas Instruments
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
LM3S1439-IBZ50-A2 Information
LM3S1439-IBZ50-A2 by Texas Instruments is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for LM3S1439-IBZ50-A2
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
726-1134-ND
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DigiKey | IC MCU 32BIT 96KB FLASH 108BGA Min Qty: 184 Lead time: 46 Weeks Container: Tray | Limited Supply - Call |
|
$16.2891 | Buy Now |
Part Details for LM3S1439-IBZ50-A2
LM3S1439-IBZ50-A2 CAD Models
LM3S1439-IBZ50-A2 Part Data Attributes
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LM3S1439-IBZ50-A2
Texas Instruments
Buy Now
Datasheet
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Compare Parts:
LM3S1439-IBZ50-A2
Texas Instruments
Stellaris LM3S Microcontroller 108-NFBGA -40 to 85
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Part Package Code | BGA | |
| Package Description | BGA-108 | |
| Pin Count | 108 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | Texas Instruments | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| Clock Frequency-Max | 8.192 MHz | |
| DAC Channels | NO | |
| DMA Channels | NO | |
| External Data Bus Width | ||
| JESD-30 Code | S-PBGA-B108 | |
| JESD-609 Code | e1 | |
| Length | 10 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 52 | |
| Number of Terminals | 108 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA108,12X12,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 32768 | |
| ROM (words) | 98304 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.5 mm | |
| Speed | 50 MHz | |
| Supply Voltage-Max | 2.75 V | |
| Supply Voltage-Min | 2.5 V | |
| Supply Voltage-Nom | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 10 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |