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Automotive grade 3 rail simple power sequencer with fixed time delay 6-SOT-23 -40 to 125
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LM3880QMF-1AC/NOPB by Texas Instruments is an Other Signal Circuit.
Other Signal Circuits are under the broader part category of Signal Circuits.
A signal is an electronic means of transmitting information, either as an analog signal with continuous values or a digital signal with discrete values. Signals are used in various systems and networks. Read more about Signal Circuits on our Signal Circuits part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
296-LM3880QMF-1AC/NOPBCT-ND
|
DigiKey | IC PWR SUPPLY SEQUENCER SOT23-6 Min Qty: 1 Lead time: 6 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) |
2458 In Stock |
|
$0.8053 / $1.6800 | Buy Now |
DISTI #
926-LM3880QMF1ACNOPB
|
Mouser Electronics | Supervisory Circuits Automotive grade 3 r ail simple power seq A 926-LM3880QMFE1ACNPB RoHS: Compliant | 1261 |
|
$0.8110 / $1.6800 | Buy Now |
|
LCSC | Active High 2.7V5.5V 3 SOT-23-6 Supervisor and Reset ICs ROHS | 36 |
|
$0.9992 / $1.0581 | Buy Now |
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LM3880QMF-1AC/NOPB
Texas Instruments
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Datasheet
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LM3880QMF-1AC/NOPB
Texas Instruments
Automotive grade 3 rail simple power sequencer with fixed time delay 6-SOT-23 -40 to 125
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Part Package Code | SOT-23 | |
Pin Count | 6 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Texas Instruments | |
Analog IC - Other Type | ANALOG CIRCUIT | |
JESD-30 Code | R-PDSO-G6 | |
JESD-609 Code | e3 | |
Length | 2.9 mm | |
Moisture Sensitivity Level | 1 | |
Number of Channels | 3 | |
Number of Functions | 1 | |
Number of Terminals | 6 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LSSOP | |
Package Equivalence Code | TSOP6,.11,37 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.45 mm | |
Supply Current-Max (Isup) | 0.08 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.95 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 1.6 mm |
A good PCB layout for the LM3880QMF-1AC/NOPB involves keeping the input and output traces short and separate, using a star-ground configuration, and placing the decoupling capacitors close to the IC. A 4-layer PCB with a dedicated ground plane is also recommended.
Choose input capacitors with a high ripple current rating and low ESR (Equivalent Series Resistance) to minimize distortion. Output capacitors should have a high capacitance value and low ESR to ensure good low-frequency response and stability. Film capacitors or electrolytic capacitors with a high ripple current rating are good options.
The maximum power dissipation of the LM3880QMF-1AC/NOPB is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 20W at 25°C ambient temperature. However, this value can be derated to 15W at 50°C ambient temperature.
Use voltage regulators or overvoltage protection circuits to ensure that the input voltage to the LM3880QMF-1AC/NOPB remains within the recommended operating range. Undervoltage protection can be achieved using a voltage supervisor IC or a simple resistor-divider network.
The recommended heatsink for the LM3880QMF-1AC/NOPB depends on the power dissipation and ambient temperature. A heatsink with a thermal resistance of 10°C/W or lower is recommended. A small heatsink with a thermal resistance of around 5°C/W can be used for low-power applications, while a larger heatsink with a thermal resistance of around 2°C/W may be required for high-power applications.