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Automotive N-channel constant current LED controller with series DIM FET driver and fault flag 20-HTSSOP -40 to 125
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LM3423Q1MHX/NOPB by Texas Instruments is a Display Driver.
Display Drivers are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
296-LM3423Q1MHX/NOPBCT-ND
|
DigiKey | IC LED DRIVER CTRLR PWM 20HTSSOP Min Qty: 1 Lead time: 18 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) |
4399 In Stock |
|
$1.4073 / $2.7300 | Buy Now |
DISTI #
926-LM3423Q1MHX/NOPB
|
Mouser Electronics | LED Lighting Driver ICs Automotive N-channel constant current LE A 926-LM3423Q1MH/NOPB RoHS: Compliant | 2475 |
|
$1.3500 / $2.7300 | Buy Now |
|
LCSC | 1 HTSSOP-20-EP LED Drivers ROHS | 10 |
|
$3.1330 / $3.3127 | Buy Now |
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LM3423Q1MHX/NOPB
Texas Instruments
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Datasheet
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LM3423Q1MHX/NOPB
Texas Instruments
Automotive N-channel constant current LED controller with series DIM FET driver and fault flag 20-HTSSOP -40 to 125
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Part Package Code | TSSOP | |
Pin Count | 20 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Texas Instruments | |
Additional Feature | SEATED HGT-NOM | |
Input Characteristics | STANDARD | |
Interface IC Type | LED DISPLAY DRIVER | |
JESD-30 Code | R-PDSO-G20 | |
JESD-609 Code | e3 | |
Length | 6.5 mm | |
Moisture Sensitivity Level | 1 | |
Multiplexed Display Capability | NO | |
Number of Channels | 1 | |
Number of Functions | 1 | |
Number of Segments | 1 | |
Number of Terminals | 20 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Output Characteristics | CONSTANT-CURRENT | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HTSSOP | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Screening Level | AEC-Q100 | |
Seated Height-Max | 1.1 mm | |
Supply Voltage-Max | 75 V | |
Supply Voltage-Min | 4.5 V | |
Supply Voltage-Nom | 14 V | |
Surface Mount | YES | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 4.4 mm | |
fmax-Min | 2 MHz |
A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. The datasheet provides some guidelines, but a more detailed application note from TI provides additional guidance.
To ensure reliable start-up and shutdown, it's essential to follow the recommended power sequencing and voltage ramp rates. The datasheet provides guidelines for power-up and power-down sequences, and TI's application notes provide additional guidance on designing a reliable power supply.
When designing an input filter for the LM3423Q1MHX/NOPB, critical components to consider include the input capacitors, inductors, and resistors. The datasheet provides guidance on selecting these components, and TI's application notes provide additional guidance on designing an effective input filter.
To optimize the output voltage of the LM3423Q1MHX/NOPB, consider the output voltage tolerance, output voltage ripple, and output current requirements of your application. The datasheet provides guidance on adjusting the output voltage, and TI's application notes provide additional guidance on optimizing the output voltage for specific applications.
Key considerations for thermal design and heat sinking with the LM3423Q1MHX/NOPB include selecting a suitable heat sink, ensuring good thermal interface material (TIM) between the device and heat sink, and designing a PCB layout that facilitates good airflow and heat dissipation.