Part Details for LFB311G40SL1A562 by Murata Manufacturing Co Ltd
Results Overview of LFB311G40SL1A562 by Murata Manufacturing Co Ltd
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
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LFB311G40SL1A562 Information
LFB311G40SL1A562 by Murata Manufacturing Co Ltd is a Ceramic Filter.
Ceramic Filters are under the broader part category of Filters.
A filter is an electronic circuit that selectively allows certain frequencies to pass while attenuating others. They are used to extract desired signals and remove noise. Read more about Filters on our Filters part category page.
Price & Stock for LFB311G40SL1A562
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
LFB311G40SL1A562
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Avnet Americas | - Tape and Reel (Alt: LFB311G40SL1A562) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 18 Weeks, 0 Days Container: Reel | 0 |
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RFQ |
Part Details for LFB311G40SL1A562
LFB311G40SL1A562 CAD Models
LFB311G40SL1A562 Part Data Attributes
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LFB311G40SL1A562
Murata Manufacturing Co Ltd
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Datasheet
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LFB311G40SL1A562
Murata Manufacturing Co Ltd
Ceramic BPF, 1402.5MHz
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MURATA MANUFACTURING CO LTD | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 18 Weeks | |
| Center or Cutoff Frequency (fo/fc) | 1402.5 MHz | |
| Filter Type | CERAMIC BPF | |
| Height | 1.1 mm | |
| Insertion Loss-Max | 3 dB | |
| JESD-609 Code | e3 | |
| Length | 3.2 mm | |
| Mounting Type | SURFACE MOUNT | |
| Terminal Finish | Tin (Sn) | |
| Width | 1.6 mm |
LFB311G40SL1A562 Frequently Asked Questions (FAQ)
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The recommended land pattern for LFB311G40SL1A562 is a rectangular pad with a size of 3.5mm x 2.5mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask opening of 3.1mm x 2.1mm.
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The LFB311G40SL1A562 has a maximum operating temperature of 125°C. To ensure reliable operation, it's essential to consider thermal management by providing adequate heat dissipation, using thermal vias, and keeping the component away from heat sources.
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The recommended soldering profile for LFB311G40SL1A562 is a reflow soldering process with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a total process time of 120-180 seconds.
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The LFB311G40SL1A562 is designed to withstand vibrations up to 10G (10Hz-2kHz). However, it's essential to consider the specific vibration requirements of your application and ensure that the component is properly secured and mounted to prevent mechanical stress.
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To ensure magnetic shielding, it's recommended to use a shielded layout, keep the inductor away from other magnetic components, and use a ground plane or shield layer on the PCB to minimize electromagnetic interference (EMI).