Part Details for LE87251NQC by Microchip Technology Inc
Results Overview of LE87251NQC by Microchip Technology Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Smart Cities
Electronic Manufacturing
LE87251NQC Information
LE87251NQC by Microchip Technology Inc is a Line Driver or Receiver.
Line Driver or Receivers are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Price & Stock for LE87251NQC
| Part # | Distributor | Description | Stock | Price | Buy | |
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NAC | 2CH ADSL2+, 12V Line Driver, QFN16, 16 VQFN 4x4x1mm TRAY RoHS: Compliant Min Qty: 1 Package Multiple: 2450 | 0 |
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RFQ |
Part Details for LE87251NQC
LE87251NQC CAD Models
LE87251NQC Part Data Attributes
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LE87251NQC
Microchip Technology Inc
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Datasheet
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LE87251NQC
Microchip Technology Inc
Line Driver, 4 Func, 4 Driver
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | QFN-16 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.31.00.01 | |
| Differential Output | NO | |
| Driver Number of Bits | 4 | |
| Input Characteristics | STANDARD | |
| Interface IC Type | LINE DRIVER | |
| Interface Standard | GENERAL PURPOSE | |
| JESD-30 Code | S-XQCC-N16 | |
| Length | 4 mm | |
| Number of Functions | 2 | |
| Number of Terminals | 16 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Max | 12.6 V | |
| Supply Voltage-Min | 11.4 V | |
| Supply Voltage-Nom | 12 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | QUAD | |
| Width | 4 mm |
Alternate Parts for LE87251NQC
This table gives cross-reference parts and alternative options found for LE87251NQC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LE87251NQC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| LE87251NQCT | Microchip Technology Inc | Check for Price | Line Driver, 4 Func, 4 Driver | LE87251NQC vs LE87251NQCT |
LE87251NQC Frequently Asked Questions (FAQ)
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Microchip provides a recommended PCB layout in the LE87251NQC evaluation board user's guide, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
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The LE87251NQC has a programmable output voltage range. To configure the device for different output voltage ranges, you need to adjust the resistive divider network connected to the FB pin. The datasheet provides a formula to calculate the required resistor values for the desired output voltage range.
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Although the datasheet specifies a maximum input voltage of 18V, the device can handle input voltages up to 20V for short durations (e.g., during startup or voltage transients). However, sustained operation above 18V may reduce the device's reliability and lifespan.
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To ensure the device's thermal performance, it's essential to provide adequate heat sinking, such as a thermal pad or a heat sink attached to the package. Additionally, ensure good airflow around the device, and avoid blocking the thermal pad or heat sink with other components or obstacles.
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To minimize EMI and noise, use a pi-filter (C-L-C) configuration on the input and output lines, and ensure that the device is placed away from noise-sensitive components. Additionally, use a low-ESR output capacitor and a ferrite bead or common-mode choke to further reduce noise and EMI.