Part Details for LDTC115EET1G by LRC Leshan Radio Co Ltd
Results Overview of LDTC115EET1G by LRC Leshan Radio Co Ltd
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Renewable Energy
LDTC115EET1G Information
LDTC115EET1G by LRC Leshan Radio Co Ltd is a Small Signal Bipolar Transistor.
Small Signal Bipolar Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for LDTC115EET1G
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
LDTC115EET1G
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Avnet Asia | NPN TRANSISTOR VECO 50V SC-89 (Alt: LDTC115EET1G) RoHS: Compliant Min Qty: 30000 Package Multiple: 3000 Lead time: 12 Weeks, 0 Days | 0 |
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RFQ |
Part Details for LDTC115EET1G
LDTC115EET1G CAD Models
LDTC115EET1G Part Data Attributes
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LDTC115EET1G
LRC Leshan Radio Co Ltd
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Datasheet
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LDTC115EET1G
LRC Leshan Radio Co Ltd
Small Signal Bipolar Transistor, 0.1A I(C), 1-Element, NPN, Silicon,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | LESHAN RADIO CO LTD | |
| Package Description | , | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| Collector Current-Max (IC) | 0.1 A | |
| DC Current Gain-Min (hFE) | 80 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 1 | |
| Number of Elements | 1 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Polarity/Channel Type | NPN | |
| Power Dissipation-Max (Abs) | 0.3 W | |
| Surface Mount | YES | |
| Terminal Finish | TIN | |
| Transistor Element Material | SILICON |
LDTC115EET1G Frequently Asked Questions (FAQ)
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The recommended PCB layout and land pattern can be found in the manufacturer's application note or design guide. It's essential to follow the recommended layout to ensure optimal performance, minimize noise, and reduce electromagnetic interference (EMI).
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Proper thermal management is crucial to ensure the device's reliability and performance. The datasheet provides thermal resistance values, but it's essential to consider the device's power dissipation, ambient temperature, and airflow when designing the thermal management system. A heat sink or thermal pad may be necessary to maintain a safe operating temperature.
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The recommended soldering conditions can be found in the manufacturer's application note or soldering guide. Typically, a soldering temperature of 250°C to 260°C with a dwell time of 3-5 seconds is recommended. It's essential to follow the recommended soldering conditions to prevent damage to the device.
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To ensure reliability and quality, it's essential to follow the manufacturer's recommended design guidelines, use a qualified manufacturer-approved supplier, and implement a robust testing and validation process. Additionally, consider implementing a failure mode and effects analysis (FMEA) to identify and mitigate potential failure modes.
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Common failure modes of the LDTC115EET1G include overheating, electrical overstress, and mechanical stress. To mitigate these failure modes, ensure proper thermal management, follow the recommended operating conditions, and implement protective measures such as overvoltage protection and surge protection devices.