-
Part Symbol
-
Footprint
-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
Part Details for LCMXO3LF-9400C-6BG400I by Lattice Semiconductor Corporation
Results Overview of LCMXO3LF-9400C-6BG400I by Lattice Semiconductor Corporation
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
LCMXO3LF-9400C-6BG400I Information
LCMXO3LF-9400C-6BG400I by Lattice Semiconductor Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for LCMXO3LF-9400C-6BG400I
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
55AJ0716
|
Newark | Lattice Machxo3Lf , 9400 Luts, 3.3V Rohs Compliant: Yes |Lattice Semiconductor LCMXO3LF-9400C-6BG400I RoHS: Compliant Min Qty: 90 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$29.5800 / $31.1100 | Buy Now |
|
DISTI #
LCMXO3LF-9400C-6BG400I-ND
|
DigiKey | IC FPGA 335 I/O 400CABGA Min Qty: 90 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
|
$29.3501 | Buy Now |
|
DISTI #
842-O3LF9400C6BG400I
|
Mouser Electronics | FPGA - Field Programmable Gate Array Lattice MachXO3LF , 9400 LUTs, 3.3V RoHS: Compliant | 0 |
|
$28.2800 / $33.7000 | Order Now |
|
DISTI #
V36:1790_16660817
|
Arrow Electronics | FPGA MACHXO3 Family 9400 Cells 65nm Technology 1.2V 400-Pin CABGA Tray RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks Date Code: 2509 | Americas - 180 |
|
$28.9700 / $29.7100 | Buy Now |
|
DISTI #
88111976
|
Verical | FPGA MACHXO3 Family 9400 Cells 65nm Technology 1.2V 400-Pin CABGA Tray RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 2509 | Americas - 180 |
|
$28.9700 / $29.5200 | Buy Now |
Part Details for LCMXO3LF-9400C-6BG400I
LCMXO3LF-9400C-6BG400I CAD Models
LCMXO3LF-9400C-6BG400I Part Data Attributes
|
|
LCMXO3LF-9400C-6BG400I
Lattice Semiconductor Corporation
Buy Now
Datasheet
|
Compare Parts:
LCMXO3LF-9400C-6BG400I
Lattice Semiconductor Corporation
Field Programmable Gate Array, PBGA400, CABGA-400
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | LATTICE SEMICONDUCTOR CORP | |
| Package Description | CABGA-400 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Lattice Semiconductor | |
| Additional Feature | ALSO OPERATES AT 3.3 V NOMINAL SUPPLY | |
| Clock Frequency-Max | 128.7 MHz | |
| JESD-30 Code | S-PBGA-B400 | |
| JESD-609 Code | e1 | |
| Length | 17 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 1175 | |
| Number of Inputs | 335 | |
| Number of Logic Cells | 9400 | |
| Number of Outputs | 335 | |
| Number of Terminals | 400 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 1175 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA400,20X20,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Seated Height-Max | 1.7 mm | |
| Supply Voltage-Max | 3.465 V | |
| Supply Voltage-Min | 2.375 V | |
| Supply Voltage-Nom | 2.5 V | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 17 mm |
Alternate Parts for LCMXO3LF-9400C-6BG400I
This table gives cross-reference parts and alternative options found for LCMXO3LF-9400C-6BG400I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LCMXO3LF-9400C-6BG400I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| LCMXO3LF-9400C-6BG400C | Lattice Semiconductor Corporation | $32.7214 | Field Programmable Gate Array, PBGA400, CABGA-400 | LCMXO3LF-9400C-6BG400I vs LCMXO3LF-9400C-6BG400C |
LCMXO3LF-9400C-6BG400I Frequently Asked Questions (FAQ)
-
Lattice provides a PCB layout and routing guide for the LCMXO3LF family, which includes recommendations for signal integrity, power distribution, and thermal management. It's available on the Lattice website.
-
Lattice recommends using a daisy-chain configuration for JTAG, with each device connected in series. Make sure to follow the JTAG specification and use a JTAG cable with a 1-kΩ pull-up resistor on the TCK line.
-
The LCMXO3LF-9400C-6BG400I requires a specific power sequencing order: VCCIO, VCC, and then VCCAUX. The power supply voltage must be within the recommended range, and the power-on reset (POR) signal must be asserted during power-up.
-
To optimize power consumption, use the Lattice Power Calculator tool to estimate power consumption based on your design. Implement power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS).
-
The LCMXO3LF-9400C-6BG400I has a thermal design power (TDP) of 1.5 W. Ensure good airflow around the device, and consider using a heat sink or thermal interface material (TIM) to reduce junction temperature.