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Field Programmable Gate Array, PBGA256, CABGA-256
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
LCMXO3LF-6900C-6BG256I by Lattice Semiconductor Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
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55AJ0694
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LCMXO3LF-6900C-6BG256I
Lattice Semiconductor Corporation
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Datasheet
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LCMXO3LF-6900C-6BG256I
Lattice Semiconductor Corporation
Field Programmable Gate Array, PBGA256, CABGA-256
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | LATTICE SEMICONDUCTOR CORP | |
Package Description | CABGA-256 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Lattice Semiconductor | |
Additional Feature | ALSO OPERATES AT 3.3 V NOMINAL SUPPLY | |
JESD-30 Code | S-PBGA-B256 | |
JESD-609 Code | e1 | |
Length | 14 mm | |
Moisture Sensitivity Level | 3 | |
Number of CLBs | 858 | |
Number of Inputs | 206 | |
Number of Logic Cells | 6900 | |
Number of Outputs | 206 | |
Number of Terminals | 256 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 858 CLBS | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA256,16X16,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Seated Height-Max | 1.7 mm | |
Supply Voltage-Max | 3.465 V | |
Supply Voltage-Min | 2.375 V | |
Supply Voltage-Nom | 2.5 V | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 14 mm |
The LCMXO3LF-6900C-6BG256I has an operating temperature range of -40°C to 100°C.
The LCMXO3LF-6900C-6BG256I has a built-in clock management system that allows for the creation of a clock tree. This can be implemented using the Lattice Diamond software or by using the device's clock management primitives.
The PLL in the LCMXO3LF-6900C-6BG256I can operate up to 450 MHz.
The I/O banks in the LCMXO3LF-6900C-6BG256I can be configured using the Lattice Diamond software or by using the device's I/O configuration primitives. The device supports multiple I/O standards, including LVCMOS, LVDS, and SSTL.
The power consumption of the LCMXO3LF-6900C-6BG256I depends on the specific application and usage. However, the typical power consumption is around 100-200 mW.