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Part Details for LCMXO2280C-5FTN324C by Lattice Semiconductor Corporation
Results Overview of LCMXO2280C-5FTN324C by Lattice Semiconductor Corporation
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Industrial Automation
Computing and Data Storage
Electronic Manufacturing
LCMXO2280C-5FTN324C Information
LCMXO2280C-5FTN324C by Lattice Semiconductor Corporation is a Programmable Logic Device.
Programmable Logic Devices are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for LCMXO2280C-5FTN324C
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
55AJ0397
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Newark | Lattice Machxo , 2280 Luts, 1.8/2.5/3.3V Rohs Compliant: Yes |Lattice Semiconductor LCMXO2280C-5FTN324C RoHS: Compliant Min Qty: 84 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$43.3200 / $45.5500 | Buy Now |
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DISTI #
220-1737-ND
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DigiKey | IC FPGA 271 I/O 324FTBGA Min Qty: 1 Lead time: 20 Weeks Container: Tray |
84 In Stock |
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$39.8501 / $49.3500 | Buy Now |
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DISTI #
842-MXO2280C5FTN324C
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Mouser Electronics | FPGA - Field Programmable Gate Array 2280 LUTS 271 I/O RoHS: Compliant | 59 |
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$39.8500 / $49.3500 | Buy Now |
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Flip Electronics | Stock | 8541 |
|
RFQ | |
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Win Source Electronics | IC FPGA 271 I/O 324FTBGA | 2700 |
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$50.7657 / $76.1486 | Buy Now |
Part Details for LCMXO2280C-5FTN324C
LCMXO2280C-5FTN324C CAD Models
LCMXO2280C-5FTN324C Part Data Attributes
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LCMXO2280C-5FTN324C
Lattice Semiconductor Corporation
Buy Now
Datasheet
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Compare Parts:
LCMXO2280C-5FTN324C
Lattice Semiconductor Corporation
Flash PLD, 3.6ns, CMOS, PBGA324, 19 X 19 MM, ROHS COMPLIANT, FTBGA-324
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | LATTICE SEMICONDUCTOR CORP | |
| Part Package Code | BGA | |
| Package Description | FTBGA-324 | |
| Pin Count | 324 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Lattice Semiconductor | |
| Clock Frequency-Max | 185.1 MHz | |
| Combinatorial Delay of a CLB-Max | 3.6 ns | |
| JESD-30 Code | S-PBGA-B324 | |
| JESD-609 Code | e1 | |
| Length | 19 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 285 | |
| Number of Inputs | 271 | |
| Number of Logic Cells | 2280 | |
| Number of Outputs | 271 | |
| Number of Terminals | 324 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 285 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA324,18X18,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.7 mm | |
| Supply Voltage-Max | 3.465 V | |
| Supply Voltage-Min | 1.71 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 19 mm |
LCMXO2280C-5FTN324C Frequently Asked Questions (FAQ)
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Lattice Semiconductor provides a PCB layout guide and routing recommendations in their application notes and design guides. It's essential to follow these guidelines to ensure optimal performance, signal integrity, and thermal management.
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A recommended power-up sequence involves a controlled ramp-up of the power supply voltage, followed by a delay to allow the FPGA to initialize. The specific sequence may vary depending on the design requirements and constraints.
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Proper thermal management involves using thermal interfaces, heat sinks, and thermal vias to dissipate heat. It's essential to follow Lattice Semiconductor's thermal management guidelines and consider the specific design requirements and environmental conditions.
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Signal integrity and EMI mitigation involve careful PCB layout, routing, and shielding. It's essential to follow best practices for signal routing, use of ground planes, and shielding to minimize EMI and ensure signal integrity.
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Lattice Semiconductor provides a range of design tools, including Lattice Diamond, Lattice Radiant, and Lattice Propel. The recommended design flow involves using these tools to develop, simulate, and verify the FPGA design.