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Part Details for LCMXO2280C-4FTN256C by Lattice Semiconductor Corporation
Results Overview of LCMXO2280C-4FTN256C by Lattice Semiconductor Corporation
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Industrial Automation
Computing and Data Storage
Electronic Manufacturing
LCMXO2280C-4FTN256C Information
LCMXO2280C-4FTN256C by Lattice Semiconductor Corporation is a Programmable Logic Device.
Programmable Logic Devices are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for LCMXO2280C-4FTN256C
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
55AJ0385
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Newark | Lattice Machxo , 2280 Luts, 1.8/2.5/3.3V Rohs Compliant: Yes |Lattice Semiconductor LCMXO2280C-4FTN256C RoHS: Compliant Min Qty: 90 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$36.7900 / $38.6900 | Buy Now |
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DISTI #
220-1069-ND
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DigiKey | IC FPGA 211 I/O 256FTBGA Min Qty: 1 Lead time: 20 Weeks Container: Tray |
83 In Stock |
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$33.8125 / $41.9000 | Buy Now |
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DISTI #
842-MXO2280C4FTN256C
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Mouser Electronics | FPGA - Field Programmable Gate Array 2280 LUTs 211 IO 1.8 /2.5/3.3V -4 Spd RoHS: Compliant | 66 |
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$35.1600 / $41.8900 | Buy Now |
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Cytech Systems Limited | IC FPGA 211 I/O 256FTBGA | 9000 |
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RFQ | |
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Flip Electronics | Stock | 185 |
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RFQ |
Part Details for LCMXO2280C-4FTN256C
LCMXO2280C-4FTN256C CAD Models
LCMXO2280C-4FTN256C Part Data Attributes
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LCMXO2280C-4FTN256C
Lattice Semiconductor Corporation
Buy Now
Datasheet
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Compare Parts:
LCMXO2280C-4FTN256C
Lattice Semiconductor Corporation
Flash PLD, 4.4ns, CMOS, PBGA256, 17 X 17 MM, ROHS COMPLIANT, FTBGA-256
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | LATTICE SEMICONDUCTOR CORP | |
| Part Package Code | BGA | |
| Package Description | FTBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Lattice Semiconductor | |
| Clock Frequency-Max | 153.8 MHz | |
| Combinatorial Delay of a CLB-Max | 4.4 ns | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e1 | |
| Length | 17 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 285 | |
| Number of Inputs | 211 | |
| Number of Logic Cells | 2280 | |
| Number of Outputs | 211 | |
| Number of Terminals | 256 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 285 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.7 mm | |
| Supply Voltage-Max | 3.465 V | |
| Supply Voltage-Min | 1.71 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 17 mm |
LCMXO2280C-4FTN256C Frequently Asked Questions (FAQ)
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Lattice provides a PCB layout guide and reference design files for the LCMXO2280C-4FTN256C. It's recommended to follow these guidelines to ensure optimal signal integrity and minimize signal degradation.
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Lattice recommends a power-up sequence that includes a slow ramp-up of the core voltage, followed by a delay before configuring the FPGA. This ensures that the FPGA is properly initialized and configured.
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Lattice recommends using a heat sink or thermal interface material to dissipate heat. The device should be mounted on a multi-layer PCB with thermal vias to improve heat dissipation. Additionally, ensure good airflow around the device.
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Optimize power consumption by using the lowest possible voltage and frequency for the application. Use the FPGA's built-in power management features, such as dynamic voltage and frequency scaling, to reduce power consumption. Additionally, use decoupling capacitors to reduce power noise.
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Lattice recommends using the internal oscillator with a high-frequency clock (e.g., 100 MHz) and dividing it down to generate lower-frequency clocks as needed. This ensures optimal clock signal quality and reduces jitter.