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Part Details for LAXP2-5E-5TN144E by Lattice Semiconductor Corporation
Results Overview of LAXP2-5E-5TN144E by Lattice Semiconductor Corporation
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
LAXP2-5E-5TN144E Information
LAXP2-5E-5TN144E by Lattice Semiconductor Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for LAXP2-5E-5TN144E
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
54AJ9835
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Newark | Latticexp2 Auto Grade (Aec-Q100), 4.8K Luts 1.2V Rohs Compliant: Yes |Lattice Semiconductor LAXP2-5E-5TN144E RoHS: Compliant Min Qty: 60 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$32.9200 / $34.6100 | Buy Now |
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DISTI #
LAXP2-5E-5TN144E-ND
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DigiKey | IC FPGA 100 I/O 144TQFP Min Qty: 1 Lead time: 20 Weeks Container: Tray |
98 In Stock |
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$30.2500 / $37.5000 | Buy Now |
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DISTI #
842-LAXP2-5E-5TN144E
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Mouser Electronics | FPGA - Field Programmable Gate Array Auto Grade LatticeXP2-5E RoHS: Compliant | 115 |
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$31.4600 / $37.5000 | Buy Now |
Part Details for LAXP2-5E-5TN144E
LAXP2-5E-5TN144E CAD Models
LAXP2-5E-5TN144E Part Data Attributes
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LAXP2-5E-5TN144E
Lattice Semiconductor Corporation
Buy Now
Datasheet
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LAXP2-5E-5TN144E
Lattice Semiconductor Corporation
Field Programmable Gate Array, 5000 Gates, 435MHz, 5000-Cell, PQFP144, 20 X 20 MM, LEAD FREE, TQFP-144
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | LATTICE SEMICONDUCTOR CORP | |
| Part Package Code | QFP | |
| Pin Count | 144 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Lattice Semiconductor | |
| Clock Frequency-Max | 435 MHz | |
| JESD-30 Code | S-PQFP-G144 | |
| JESD-609 Code | e3 | |
| Length | 20 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Equivalent Gates | 5000 | |
| Number of Inputs | 100 | |
| Number of Logic Cells | 5000 | |
| Number of Outputs | 100 | |
| Number of Terminals | 144 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 5000 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1.6 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 20 mm |
LAXP2-5E-5TN144E Frequently Asked Questions (FAQ)
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The recommended power-up sequence is to apply VCCIO first, followed by VCCINT, and then VCCAUX. This ensures that the internal voltage regulators are powered up correctly.
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Use a high-quality clock source, such as a crystal oscillator or a phase-locked loop (PLL), and ensure that the clock signal is properly terminated and routed to minimize skew and jitter.
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The built-in PLL has limitations on the input frequency range, output frequency range, and jitter tolerance. Refer to the datasheet for specific limitations and ensure that your design requirements are within these limits.
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Use the device's power-saving features, such as clock gating and dynamic voltage and frequency scaling. Also, optimize your design to minimize switching activity and use low-power modes when possible.
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Ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the thermal pads on the package. Also, consider using thermal interface materials to improve heat transfer.