Part Details for KBPC3506 by EIC Semiconductor Inc
Results Overview of KBPC3506 by EIC Semiconductor Inc
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- CAD Models: (Request Part)
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Medical Imaging
Robotics and Drones
KBPC3506 Information
KBPC3506 by EIC Semiconductor Inc is a Bridge Rectifier Diode.
Bridge Rectifier Diodes are under the broader part category of Diodes.
A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.
Part Details for KBPC3506
KBPC3506 CAD Models
KBPC3506 Part Data Attributes
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KBPC3506
EIC Semiconductor Inc
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Datasheet
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KBPC3506
EIC Semiconductor Inc
Rectifier Diode,
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | EIC SEMICONDUCTOR CO LTD | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.10.00.80 | |
| Samacsys Manufacturer | EIC Semiconductor | |
| Additional Feature | HIGH RELIABILITY | |
| Breakdown Voltage-Min | 600 V | |
| Configuration | BRIDGE, 4 ELEMENTS | |
| Diode Element Material | SILICON | |
| Diode Type | BRIDGE RECTIFIER DIODE | |
| Forward Voltage-Max (VF) | 1.1 V | |
| JESD-30 Code | S-PUFM-D4 | |
| Non-rep Pk Forward Current-Max | 400 A | |
| Number of Elements | 4 | |
| Number of Phases | 1 | |
| Number of Terminals | 4 | |
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Current-Max | 35 A | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | SQUARE | |
| Package Style | FLANGE MOUNT | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Reference Standard | TS 16949 | |
| Rep Pk Reverse Voltage-Max | 600 V | |
| Surface Mount | NO | |
| Terminal Form | SOLDER LUG | |
| Terminal Position | UPPER | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
KBPC3506 Frequently Asked Questions (FAQ)
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The recommended PCB layout for optimal thermal performance involves placing the device on a thick copper plane, using thermal vias to dissipate heat, and keeping the component away from other heat sources. A minimum of 2oz copper thickness is recommended.
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To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves, ensure good thermal management, and avoid exceeding the maximum junction temperature (Tj) of 150°C.
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Handle the device by the body, avoiding touching the leads or pins. Store the device in a dry, cool place, away from direct sunlight and moisture. Avoid bending or flexing the leads during handling and assembly.
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While the KBPC3506 is a high-quality device, it may not meet the specific requirements for high-reliability or aerospace applications. It's essential to consult with the manufacturer and review the device's qualification and certification status before using it in such applications.
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The KBPC3506 has an ESD rating of Human Body Model (HBM) ≥ 2kV. Handle the device with ESD-protective equipment, such as wrist straps, mats, and bags, to prevent damage from static electricity.