Part Details for KBPC2508I by Diotec Semiconductor AG
Results Overview of KBPC2508I by Diotec Semiconductor AG
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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KBPC2508I Information
KBPC2508I by Diotec Semiconductor AG is a Bridge Rectifier Diode.
Bridge Rectifier Diodes are under the broader part category of Diodes.
A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.
Price & Stock for KBPC2508I
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
KBPC2508I-DIO
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TME | Bridge rectifier: single-phase, Urmax: 800V, If: 25A, Ifsm: 270A Min Qty: 1 | 210 |
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$1.5900 / $2.4800 | Buy Now |
Part Details for KBPC2508I
KBPC2508I CAD Models
KBPC2508I Part Data Attributes
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KBPC2508I
Diotec Semiconductor AG
Buy Now
Datasheet
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KBPC2508I
Diotec Semiconductor AG
Bridge Rectifier Diode, 1 Phase, 25A, 800V V(RRM), Silicon, 28.60 X 28.60 MM, 7.30 MM HEIGHT, ROHS COMPLIANT PACKAGE-4
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | DIOTEC SEMICONDUCTOR AG | |
| Package Description | 28.60 X 28.60 MM, 7.39 MM HEIGHT, ROHS COMPLIANT PACKAGE-4 | |
| Pin Count | 4 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.10.00.80 | |
| Case Connection | ISOLATED | |
| Configuration | BRIDGE, 4 ELEMENTS | |
| Diode Element Material | SILICON | |
| Diode Type | BRIDGE RECTIFIER DIODE | |
| Forward Voltage-Max (VF) | 1.2 V | |
| JESD-30 Code | S-PUFM-W4 | |
| Moisture Sensitivity Level | 1 | |
| Non-rep Pk Forward Current-Max | 300 A | |
| Number of Elements | 4 | |
| Number of Phases | 1 | |
| Number of Terminals | 4 | |
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -50 °C | |
| Output Current-Max | 25 A | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | SQUARE | |
| Package Style | FLANGE MOUNT | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Reference Standard | UL RECOGNIZED | |
| Rep Pk Reverse Voltage-Max | 800 V | |
| Reverse Current-Max | 10 µA | |
| Reverse Recovery Time-Max | 1.5 µs | |
| Reverse Test Voltage | 800 V | |
| Surface Mount | NO | |
| Terminal Form | WIRE | |
| Terminal Position | UPPER |
Alternate Parts for KBPC2508I
This table gives cross-reference parts and alternative options found for KBPC2508I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of KBPC2508I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| KBPC2508F | SEMIKRON | Check for Price | Bridge Rectifier Diode, 1 Phase, 25A, 800V V(RRM), Silicon, 28.60 X 28.60 MM, 7.30 MM HEIGHT, PLASTIC PACKAGE-4 | KBPC2508I vs KBPC2508F |
KBPC2508I Frequently Asked Questions (FAQ)
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The recommended PCB layout for optimal thermal performance involves placing the device on a copper plane with a minimum area of 1 cm², and ensuring good thermal conductivity between the device and the PCB. A thermal via array under the device can also help to dissipate heat more efficiently.
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To ensure reliable operation in high-temperature environments, it is essential to follow the recommended derating curves for the device, and to ensure good thermal management through proper PCB design and heat sinking. Additionally, the device should be operated within its specified maximum junction temperature (Tj) of 150°C.
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The recommended soldering conditions for the KBPC2508I involve using a soldering iron with a temperature of 250°C to 260°C, and a soldering time of 2 to 3 seconds. The device should be soldered using a solder with a melting point of 180°C to 200°C.
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To protect the device from electrical overstress (EOS) and electrostatic discharge (ESD), it is essential to follow proper handling and storage procedures, and to use ESD protection devices such as TVS diodes or ESD suppressors in the circuit design. Additionally, the device should be operated within its specified maximum ratings.
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The recommended storage and handling conditions for the KBPC2508I involve storing the device in a dry, cool place with a temperature range of -40°C to 100°C, and a relative humidity of 60% or less. The device should be handled using ESD-safe materials and equipment, and should be protected from mechanical stress and vibration.