Part Details for JANTX2N6988 by Microsemi Corporation
Results Overview of JANTX2N6988 by Microsemi Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (2 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
JANTX2N6988 Information
JANTX2N6988 by Microsemi Corporation is a Small Signal Bipolar Transistor.
Small Signal Bipolar Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for JANTX2N6988
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2N6988-JANTX
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Richardson RFPD | RF SMALL SIGNAL TRANSISTOR BIPOLAR/HBT RoHS: Not Compliant Min Qty: 100 | 0 |
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$46.1200 / $47.3500 | Buy Now |
Part Details for JANTX2N6988
JANTX2N6988 CAD Models
JANTX2N6988 Part Data Attributes
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JANTX2N6988
Microsemi Corporation
Buy Now
Datasheet
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JANTX2N6988
Microsemi Corporation
Small Signal Bipolar Transistor, 0.6A I(C), 60V V(BR)CEO, 4-Element, PNP, Silicon, CERAMIC, FP-14
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | MICROSEMI CORP | |
Package Description | CERAMIC, FP-14 | |
Pin Count | 14 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
Collector Current-Max (IC) | 0.6 A | |
Collector-Emitter Voltage-Max | 60 V | |
Configuration | SEPARATE, 4 ELEMENTS | |
DC Current Gain-Min (hFE) | 100 | |
JESD-30 Code | R-CDFP-F14 | |
JESD-609 Code | e0 | |
Number of Elements | 4 | |
Number of Terminals | 14 | |
Operating Temperature-Max | 200 °C | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Shape | RECTANGULAR | |
Package Style | FLATPACK | |
Polarity/Channel Type | PNP | |
Qualification Status | Not Qualified | |
Reference Standard | MIL-19500/558D | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | FLAT | |
Terminal Position | DUAL | |
Transistor Application | SWITCHING | |
Transistor Element Material | SILICON | |
Turn-off Time-Max (toff) | 300 ns | |
Turn-on Time-Max (ton) | 45 ns |
Alternate Parts for JANTX2N6988
This table gives cross-reference parts and alternative options found for JANTX2N6988. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of JANTX2N6988, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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JANTX2N6988 | Raytheon Semiconductor | Check for Price | Small Signal Bipolar Transistor, 4-Element, PNP, Silicon, TO-86, | JANTX2N6988 vs JANTX2N6988 |
JAN2N6988 | Raytheon Semiconductor | Check for Price | Small Signal Bipolar Transistor, 4-Element, PNP, Silicon, TO-86, | JANTX2N6988 vs JAN2N6988 |
JANTX2N6988 Frequently Asked Questions (FAQ)
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Microsemi recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat. A minimum of 2 oz copper thickness is recommended, and the thermal pad should be connected to a heat sink or a thermal management system.
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To ensure radiation hardness, follow Microsemi's guidelines for radiation-hardened design, including using radiation-hardened components, minimizing signal lines, and using shielding and filtering to reduce radiation effects. Additionally, consider using error correction codes and redundancy in critical systems.
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The JANTX2N6988 is rated for operation from -55°C to 125°C, but derating may be required for high-power applications. Consult the datasheet and Microsemi's application notes for specific guidance on temperature derating.
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Microsemi recommends using ESD protection devices, such as TVS diodes or ESD arrays, on all input and output pins to prevent damage from electrostatic discharge. Follow industry-standard ESD handling procedures during assembly and testing.
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Follow Microsemi's recommended soldering and assembly procedures, including using a controlled atmosphere soldering process, and ensuring that the device is handled and stored in a clean, dry environment. Consult the datasheet and Microsemi's application notes for specific guidance.