Part Details for JANSR2N3700 by Microsemi Corporation
Results Overview of JANSR2N3700 by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (2 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (3 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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JANSR2N3700 Information
JANSR2N3700 by Microsemi Corporation is a Small Signal Bipolar Transistor.
Small Signal Bipolar Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Part Details for JANSR2N3700
JANSR2N3700 CAD Models
JANSR2N3700 Part Data Attributes
Alternate Parts for JANSR2N3700
This table gives cross-reference parts and alternative options found for JANSR2N3700. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of JANSR2N3700, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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JANKCBR2N3700 | Microsemi Corporation | Check for Price | JANKCBR2N3700, | JANSR2N3700 vs JANKCBR2N3700 |
2N3700E3 | Microsemi Corporation | Check for Price | Small Signal Bipolar Transistor, 1A I(C), 80V V(BR)CEO, 1-Element, NPN, Silicon, TO-206AA, TO-18, 3 PIN | JANSR2N3700 vs 2N3700E3 |
JANSR2N3700 Frequently Asked Questions (FAQ)
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Microsemi recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a heat sink or a metal plate for further heat dissipation.
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To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves for voltage and current. Additionally, consider using a heat sink or thermal management system to keep the junction temperature below the maximum rated value. Regular cleaning and maintenance of the device and its surroundings can also help prevent thermal-related issues.
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Microsemi recommends following standard ESD protection procedures for handling and storage, including the use of ESD-safe packaging, wrist straps, and mats. The device should be stored in a dry, cool place, away from direct sunlight and moisture. Avoid touching the device's pins or leads, and use ESD-safe tools and equipment when handling the device.
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Yes, the JANSR2N3700 is designed to meet the requirements of radiation-hardened applications. It's built with radiation-hardened materials and has undergone testing to ensure its performance in high-radiation environments. However, it's essential to consult with Microsemi's application engineers to ensure the device meets the specific requirements of your application.
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Microsemi recommends following the standard soldering and rework procedures for surface-mount devices. Use a soldering iron with a temperature range of 250°C to 260°C, and ensure the soldering time is within 3-5 seconds. For rework, use a hot air rework station with a temperature range of 200°C to 250°C, and follow the recommended rework profile.