Part Details for JANSG2N7469U2 by Infineon Technologies AG
Results Overview of JANSG2N7469U2 by Infineon Technologies AG
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
JANSG2N7469U2 Information
JANSG2N7469U2 by Infineon Technologies AG is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for JANSG2N7469U2
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
JANSG2N7469U2
|
Avnet Americas | Transistor MOSFET N-Channel 100V 75A 3-Pin CSMD - Bulk (Alt: JANSG2N7469U2) Min Qty: 25 Package Multiple: 1 Lead time: 111 Weeks, 0 Days Container: Bulk | 0 |
|
RFQ |
Part Details for JANSG2N7469U2
JANSG2N7469U2 CAD Models
JANSG2N7469U2 Part Data Attributes
|
JANSG2N7469U2
Infineon Technologies AG
Buy Now
Datasheet
|
Compare Parts:
JANSG2N7469U2
Infineon Technologies AG
Power Field-Effect Transistor, 75A I(D), 100V, 0.012ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, CERAMIC, SMD-2, 3 PIN
|
Rohs Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Reach Compliance Code | compliant | |
ECCN Code | 3A001.A.1.A | |
Factory Lead Time | 111 Weeks | |
Avalanche Energy Rating (Eas) | 363 mJ | |
Case Connection | DRAIN | |
Configuration | SINGLE WITH BUILT-IN DIODE | |
DS Breakdown Voltage-Min | 100 V | |
Drain Current-Max (ID) | 75 A | |
Drain-source On Resistance-Max | 0.012 Ω | |
FET Technology | METAL-OXIDE SEMICONDUCTOR | |
JESD-30 Code | R-CBCC-N3 | |
JESD-609 Code | e0 | |
Number of Elements | 1 | |
Number of Terminals | 3 | |
Operating Mode | ENHANCEMENT MODE | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Shape | RECTANGULAR | |
Package Style | CHIP CARRIER | |
Polarity/Channel Type | N-CHANNEL | |
Pulsed Drain Current-Max (IDM) | 300 A | |
Qualification Status | Qualified | |
Reference Standard | MIL-19500/673 | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | NO LEAD | |
Terminal Position | BOTTOM | |
Transistor Application | SWITCHING | |
Transistor Element Material | SILICON |
JANSG2N7469U2 Frequently Asked Questions (FAQ)
-
Infineon recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended. Additionally, it's essential to ensure good thermal conductivity between the device and the heat sink.
-
To ensure reliable operation in high-temperature environments, it's crucial to follow the recommended operating temperature range (TJ) of -55°C to 175°C. Additionally, consider using a heat sink with a thermal interface material (TIM) to reduce thermal resistance. Ensure proper PCB design, component selection, and thermal management to prevent overheating.
-
Infineon recommends soldering the JANSG2N7469U2 using a reflow soldering process with a peak temperature of 260°C (±5°C) and a dwell time of 20-30 seconds. The device is also compatible with wave soldering, but the temperature and dwell time should be adjusted accordingly.
-
To prevent electrostatic discharge (ESD) damage, handle the JANSG2N7469U2 in an ESD-protected environment. Use ESD-protective packaging, wrist straps, and mats during assembly. Ensure that all equipment and tools are properly grounded, and follow proper handling procedures to prevent static electricity buildup.
-
Store the JANSG2N7469U2 in its original packaging or in a dry, cool place with a relative humidity of 50% or less. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures. Store the device at a temperature range of -40°C to 30°C to prevent damage.