Datasheets
JANSG2N7469U2 by:

Power Field-Effect Transistor, 75A I(D), 100V, 0.012ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, CERAMIC, SMD-2, 3 PIN

Part Details for JANSG2N7469U2 by Infineon Technologies AG

Results Overview of JANSG2N7469U2 by Infineon Technologies AG

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Applications Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

JANSG2N7469U2 Information

JANSG2N7469U2 by Infineon Technologies AG is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.

A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.

Price & Stock for JANSG2N7469U2

Part # Distributor Description Stock Price Buy
DISTI # JANSG2N7469U2
Avnet Americas Transistor MOSFET N-Channel 100V 75A 3-Pin CSMD - Bulk (Alt: JANSG2N7469U2) Min Qty: 25 Package Multiple: 1 Lead time: 111 Weeks, 0 Days Container: Bulk 0
RFQ

Part Details for JANSG2N7469U2

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JANSG2N7469U2 Part Data Attributes

JANSG2N7469U2 Infineon Technologies AG
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JANSG2N7469U2 Infineon Technologies AG Power Field-Effect Transistor, 75A I(D), 100V, 0.012ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, CERAMIC, SMD-2, 3 PIN
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Reach Compliance Code compliant
ECCN Code 3A001.A.1.A
Factory Lead Time 111 Weeks
Avalanche Energy Rating (Eas) 363 mJ
Case Connection DRAIN
Configuration SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 100 V
Drain Current-Max (ID) 75 A
Drain-source On Resistance-Max 0.012 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR
JESD-30 Code R-CBCC-N3
JESD-609 Code e0
Number of Elements 1
Number of Terminals 3
Operating Mode ENHANCEMENT MODE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR
Package Style CHIP CARRIER
Polarity/Channel Type N-CHANNEL
Pulsed Drain Current-Max (IDM) 300 A
Qualification Status Qualified
Reference Standard MIL-19500/673
Surface Mount YES
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form NO LEAD
Terminal Position BOTTOM
Transistor Application SWITCHING
Transistor Element Material SILICON

JANSG2N7469U2 Related Parts

JANSG2N7469U2 Frequently Asked Questions (FAQ)

  • Infineon recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended. Additionally, it's essential to ensure good thermal conductivity between the device and the heat sink.

  • To ensure reliable operation in high-temperature environments, it's crucial to follow the recommended operating temperature range (TJ) of -55°C to 175°C. Additionally, consider using a heat sink with a thermal interface material (TIM) to reduce thermal resistance. Ensure proper PCB design, component selection, and thermal management to prevent overheating.

  • Infineon recommends soldering the JANSG2N7469U2 using a reflow soldering process with a peak temperature of 260°C (±5°C) and a dwell time of 20-30 seconds. The device is also compatible with wave soldering, but the temperature and dwell time should be adjusted accordingly.

  • To prevent electrostatic discharge (ESD) damage, handle the JANSG2N7469U2 in an ESD-protected environment. Use ESD-protective packaging, wrist straps, and mats during assembly. Ensure that all equipment and tools are properly grounded, and follow proper handling procedures to prevent static electricity buildup.

  • Store the JANSG2N7469U2 in its original packaging or in a dry, cool place with a relative humidity of 50% or less. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures. Store the device at a temperature range of -40°C to 30°C to prevent damage.

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