Part Details for IXDI609SIATR by IXYS Integrated Circuits Division
Results Overview of IXDI609SIATR by IXYS Integrated Circuits Division
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (4 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Automotive
IXDI609SIATR Information
IXDI609SIATR by IXYS Integrated Circuits Division is an MOSFET Driver.
MOSFET Drivers are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Part Details for IXDI609SIATR
IXDI609SIATR CAD Models
IXDI609SIATR Part Data Attributes
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IXDI609SIATR
IXYS Integrated Circuits Division
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Datasheet
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IXDI609SIATR
IXYS Integrated Circuits Division
Buffer/Inverter Based MOSFET Driver, CMOS, PDSO8, ROHS COMPLIANT, MS-012AA, SOIC-8
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | IXYS INTEGRATED CIRCUITS DIVISION | |
| Part Package Code | SOIC | |
| Package Description | ROHS COMPLIANT, MS-012AA, SOIC-8 | |
| Pin Count | 8 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| High Side Driver | NO | |
| Interface IC Type | BUFFER OR INVERTER BASED MOSFET DRIVER | |
| JESD-30 Code | R-PDSO-G8 | |
| JESD-609 Code | e3 | |
| Length | 4.9 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP8,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.75 mm | |
| Supply Voltage-Max | 35 V | |
| Supply Voltage-Min | 4.5 V | |
| Supply Voltage-Nom | 18 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Turn-off Time | 0.075 µs | |
| Turn-on Time | 0.075 µs | |
| Width | 3.9 mm |
Alternate Parts for IXDI609SIATR
This table gives cross-reference parts and alternative options found for IXDI609SIATR. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IXDI609SIATR, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
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| IXDI509SIA | IXYS Corporation | Check for Price | Buffer/Inverter Based MOSFET Driver, 9A, CMOS, PDSO8, 0.150 INCH, ROHS COMPLIANT, MS-012AA, SOP-8 | IXDI609SIATR vs IXDI509SIA |
IXDI609SIATR Frequently Asked Questions (FAQ)
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A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an inner layer or the backside of the PCB for better heat dissipation.
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Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Use a heat sink or thermal interface material to reduce thermal resistance and prevent overheating.
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Handle the device by the body, not the leads. Avoid bending or flexing the leads. Store the device in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and handling procedures to prevent ESD damage.
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The IXDI609SIATR is a commercial-grade device, not designed for high-reliability or aerospace applications. For such applications, consider using a device with a higher reliability rating, such as a MIL-PRF-19500 or NASA-approved device.
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Use a systematic approach to troubleshoot the issue. Check the power supply, input voltage, and current. Verify that the device is properly mounted and connected. Use thermal imaging or temperature measurement tools to identify overheating issues. Consult the datasheet and application notes for guidance.