Part Details for ISL32492EIBZ-T by Intersil Corporation
Results Overview of ISL32492EIBZ-T by Intersil Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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ISL32492EIBZ-T Information
ISL32492EIBZ-T by Intersil Corporation is a Line Driver or Receiver.
Line Driver or Receivers are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Price & Stock for ISL32492EIBZ-T
Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Interface ICs | 3039 |
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RFQ |
Part Details for ISL32492EIBZ-T
ISL32492EIBZ-T CAD Models
ISL32492EIBZ-T Part Data Attributes
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ISL32492EIBZ-T
Intersil Corporation
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Datasheet
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ISL32492EIBZ-T
Intersil Corporation
±60V Fault Protected, 5V, RS-485/RS-422 Transceivers with ±25V CMR and ESD Protection; MSOP8, SOIC8; Temp Range: -40° to 85°C
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | INTERSIL CORP | |
Part Package Code | MSOP, SOIC | |
Package Description | SOIC-8 | |
Pin Count | 8, 8 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Factory Lead Time | 26 Weeks | |
Differential Output | YES | |
Driver Number of Bits | 1 | |
Input Characteristics | DIFFERENTIAL SCHMITT TRIGGER | |
Interface IC Type | LINE TRANSCEIVER | |
Interface Standard | EIA-485; EIA-422 | |
JESD-30 Code | R-PDSO-G8 | |
JESD-609 Code | e3 | |
Length | 4.9 mm | |
Moisture Sensitivity Level | 2 | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Out Swing-Min | 0.8 V | |
Output Low Current-Max | 0.006 A | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | SOP | |
Package Equivalence Code | SOP8,.25 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Receive Delay-Max | 280 ns | |
Receiver Number of Bits | 1 | |
Seated Height-Max | 1.75 mm | |
Supply Current-Max | 4.5 mA | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
Supply Voltage-Nom | 5 V | |
Surface Mount | YES | |
Technology | BICMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Matte Tin (Sn) - annealed | |
Terminal Form | GULL WING | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Transmit Delay-Max | 1000 ns | |
Width | 3.9 mm |
ISL32492EIBZ-T Frequently Asked Questions (FAQ)
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A good PCB layout for the ISL32492EIBZ-T involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces connecting the device to the power supply and load. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
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To ensure the ISL32492EIBZ-T operates within its recommended operating conditions, make sure to provide a stable power supply voltage between 2.7V and 5.5V, keep the junction temperature below 125°C, and avoid exceeding the maximum ratings for input and output currents.
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The ISL32492EIBZ-T has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
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To troubleshoot issues with the ISL32492EIBZ-T, start by verifying the power supply voltage and ensuring that it's within the recommended range. Check for proper PCB layout and routing, and verify that the device is properly soldered. Use an oscilloscope to check the output waveform and verify that it's within the expected specifications.
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The ISL32492EIBZ-T has a thermal pad that must be connected to a solid ground plane to ensure proper heat dissipation. Use a thermal interface material (TIM) to improve heat transfer between the device and the PCB. Ensure good airflow around the device and avoid blocking the airflow with nearby components.