Part Details for IS61NLP102418B-250B3LI by Integrated Silicon Solution Inc
Results Overview of IS61NLP102418B-250B3LI by Integrated Silicon Solution Inc
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
IS61NLP102418B-250B3LI Information
IS61NLP102418B-250B3LI by Integrated Silicon Solution Inc is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for IS61NLP102418B-250B3LI
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
52Y2364
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Newark | 18Mb,"no-Wait"/Pipeline, sync,1Mb X 18,250Mhz,3.3V/2.5V - I/O,165 Ball Bga, Rohs |Integrated Silicon Solution/issi IS61NLP102418B-250B3LI RoHS: Not Compliant Min Qty: 144 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$17.5500 / $18.0600 | Buy Now |
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DISTI #
IS61NLP102418B-250B3LI-ND
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DigiKey | IC SRAM 18MBIT PARALLEL 165TFBGA Min Qty: 144 Lead time: 10 Weeks Container: Tray | Temporarily Out of Stock |
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$19.1381 | Buy Now |
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DISTI #
IS61NLP102418B-250B3LI
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Avnet Americas | SRAM Chip Sync Dual 3.3V 18M-Bit 1M x 18 2.6ns 165-Pin TFBGA - Bulk (Alt: IS61NLP102418B-250B3LI) RoHS: Not Compliant Min Qty: 144 Package Multiple: 144 Lead time: 12 Weeks, 0 Days Container: Bulk | 0 |
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$18.3725 / $18.7553 | Buy Now |
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DISTI #
870-NLP102418B25B3LI
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Mouser Electronics | SRAM 18Mb,"No-Wait"/Pipeline,Sync,1Mb x 18,250Mhz,3.3v/2.5v - I/O,165 Ball BGA, RoHS RoHS: Compliant | 0 |
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$19.1300 / $19.1400 | Order Now |
Part Details for IS61NLP102418B-250B3LI
IS61NLP102418B-250B3LI CAD Models
IS61NLP102418B-250B3LI Part Data Attributes
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IS61NLP102418B-250B3LI
Integrated Silicon Solution Inc
Buy Now
Datasheet
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Compare Parts:
IS61NLP102418B-250B3LI
Integrated Silicon Solution Inc
Standard SRAM, 1MX18, 2.6ns, CMOS, PBGA165, 13 X 15 MM, LEAD FREE, TFBGA-165
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Package Description | TBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 12 Weeks | |
| Samacsys Manufacturer | Integrated Silicon Solution Inc. | |
| Access Time-Max | 2.6 ns | |
| JESD-30 Code | R-PBGA-B165 | |
| Length | 15 mm | |
| Memory Density | 18874368 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 18 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 1MX18 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max (Vsup) | 3.465 V | |
| Supply Voltage-Min (Vsup) | 3.135 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 13 mm |
Alternate Parts for IS61NLP102418B-250B3LI
This table gives cross-reference parts and alternative options found for IS61NLP102418B-250B3LI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IS61NLP102418B-250B3LI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| IS61NLP102418B-250B3I | Integrated Silicon Solution Inc | Check for Price | Standard SRAM, 1MX18, 2.6ns, CMOS, PBGA165, 13 X 15 MM, TFBGA-165 | IS61NLP102418B-250B3LI vs IS61NLP102418B-250B3I |
| IS61NLP102418B-250B3 | Integrated Silicon Solution Inc | Check for Price | Standard SRAM, 1MX18, 2.6ns, CMOS, PBGA165, 13 X 15 MM, TFBGA-165 | IS61NLP102418B-250B3LI vs IS61NLP102418B-250B3 |
IS61NLP102418B-250B3LI Frequently Asked Questions (FAQ)
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The recommended PCB layout for optimal performance can be found in the application note AN-1016 from ISSI, which provides guidelines for PCB design, layout, and routing to minimize noise and ensure signal integrity.
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The IS61NLP102418B-250B3LI has a thermal junction-to-case rating of 30°C/W. To handle thermal management, ensure good airflow around the device, use a heat sink if necessary, and follow the thermal design guidelines in the datasheet.
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The IS61NLP102418B-250B3LI has an operating temperature range of -40°C to 85°C, but it's recommended to operate within -20°C to 70°C for optimal performance and reliability.
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ISSI provides a troubleshooting guide in their application note AN-1017, which covers common issues, symptoms, and solutions for the IS61NLP102418B-250B3LI. Additionally, contact ISSI's technical support team for further assistance.
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The recommended power-up sequence for the IS61NLP102418B-250B3LI is to apply VCC first, followed by VPP, and then the clock signal. This ensures proper device initialization and prevents latch-up or other issues.