Part Details for IS61DDPB251236A-400M3L by Integrated Silicon Solution Inc
Results Overview of IS61DDPB251236A-400M3L by Integrated Silicon Solution Inc
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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IS61DDPB251236A-400M3L Information
IS61DDPB251236A-400M3L by Integrated Silicon Solution Inc is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for IS61DDPB251236A-400M3L
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
77T0703
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Newark | 18Mb, Ddr Iip (Burst Of 2) Cio, Sync Sram, 512K X 36, 2.5 Read Latency, 165 Ball Fbga (15X17 Mm), Rohs |Integrated Silicon Solution/issi IS61DDPB251236A-400M3L RoHS: Not Compliant Min Qty: 105 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$39.3000 | Buy Now |
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DISTI #
IS61DDPB251236A-40
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Avnet Americas | SRAM Chip Sync Single 1.8V 18M-Bit 512K x 36 0.45ns 165-Pin LFBGA - Bulk (Alt: IS61DDPB251236A-40) RoHS: Not Compliant Min Qty: 105 Package Multiple: 105 Lead time: 28 Weeks, 0 Days Container: Bulk | 0 |
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RFQ | |
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DISTI #
870-61B251236A400M3L
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Mouser Electronics | SRAM 18Mb, DDR IIP (Burst of 2) CIO, Sync SRAM, 512K x 36, 2.5 Read Latency, 165 Ball FBGA (15x17 mm), RoHS RoHS: Compliant | 0 |
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$41.8100 | Order Now |
Part Details for IS61DDPB251236A-400M3L
IS61DDPB251236A-400M3L CAD Models
IS61DDPB251236A-400M3L Part Data Attributes
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IS61DDPB251236A-400M3L
Integrated Silicon Solution Inc
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Datasheet
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IS61DDPB251236A-400M3L
Integrated Silicon Solution Inc
DDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, BGA165,11X15,40 | |
| Pin Count | 165 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 28 Weeks | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 400 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B165 | |
| Length | 17 mm | |
| Memory Density | 18874368 bit | |
| Memory IC Type | DDR SRAM | |
| Memory Width | 36 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 512KX36 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Standby Current-Max | 0.32 A | |
| Supply Current-Max | 0.8 mA | |
| Supply Voltage-Max (Vsup) | 1.89 V | |
| Supply Voltage-Min (Vsup) | 1.71 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 15 mm |