Part Details for IS43DR16640C-25DBL by Integrated Silicon Solution Inc
Results Overview of IS43DR16640C-25DBL by Integrated Silicon Solution Inc
- Distributor Offerings: (8 listings)
- Number of FFF Equivalents: (6 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
IS43DR16640C-25DBL Information
IS43DR16640C-25DBL by Integrated Silicon Solution Inc is a DRAM.
DRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for IS43DR16640C-25DBL
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
81Y1253
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Newark | Dram, 64M X 16Bit, Wbga-84, Dram Type:Ddr2, Memory Configuration:64M X 16Bit, Clock Frequency Max:400Mhz, Ic Case/Package:Wbga, No. Of Pins:84Pins, Supply Voltage Nom:1.8V, Ic Mounting:Surface Mount, Operating Temperature Min:0°C Rohs Compliant: Yes |Integrated Silicon Solution/issi IS43DR16640C-25DBL RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk | 24 |
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$2.1500 | Buy Now |
DISTI #
706-1562-ND
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DigiKey | IC DRAM 1GBIT PARALLEL 84TWBGA Min Qty: 1 Lead time: 8 Weeks Container: Tray |
3800 In Stock |
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$2.8807 / $3.6300 | Buy Now |
DISTI #
81Y1253
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Avnet Americas | DRAM Chip DDR2 SDRAM 1Gbit 64M X 16 1.8V 84-Pin TWBGA Tray - Bulk (Alt: 81Y1253) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 9 Weeks, 3 Days Container: Bulk | 24 Partner Stock |
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$3.3100 / $4.1800 | Buy Now |
DISTI #
IS43DR16640C-25DBL
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Avnet Americas | DRAM Chip DDR2 SDRAM 1Gbit 64M X 16 1.8V 84-Pin TWBGA Tray - Trays (Alt: IS43DR16640C-25DBL) RoHS: Compliant Min Qty: 418 Package Multiple: 209 Lead time: 8 Weeks, 0 Days Container: Tray | 0 |
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$2.1275 / $2.2755 | Buy Now |
DISTI #
870-43DR16640C-25DBL
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Mouser Electronics | DRAM DDR2,1G,1.8V, RoHs 400MHz, 64Mx16 RoHS: Compliant | 2731 |
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$2.8800 / $3.6300 | Buy Now |
DISTI #
IS43DR16640C-25DBL
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Avnet Asia | DRAM Chip DDR2 SDRAM 1Gbit 64M X 16 1.8V 84-Pin TWBGA Tray (Alt: IS43DR16640C-25DBL) RoHS: Compliant Min Qty: 209 Package Multiple: 209 Lead time: 6 Weeks, 0 Days | 0 |
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RFQ | |
DISTI #
IS43DR16640C-25DBL
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Avnet Silica | DRAM Chip DDR2 SDRAM 1Gbit 64M X 16 18V 84Pin TWBGA Tray (Alt: IS43DR16640C-25DBL) RoHS: Compliant Min Qty: 209 Package Multiple: 209 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
DISTI #
IS43DR16640C-25DBL
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EBV Elektronik | DRAM Chip DDR2 SDRAM 1Gbit 64M X 16 18V 84Pin TWBGA Tray (Alt: IS43DR16640C-25DBL) RoHS: Compliant Min Qty: 209 Package Multiple: 209 Lead time: 7 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for IS43DR16640C-25DBL
IS43DR16640C-25DBL CAD Models
IS43DR16640C-25DBL Part Data Attributes
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IS43DR16640C-25DBL
Integrated Silicon Solution Inc
Buy Now
Datasheet
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Compare Parts:
IS43DR16640C-25DBL
Integrated Silicon Solution Inc
DDR DRAM, 64MX16, 0.4ns, CMOS, PBGA84, TWBGA-84
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.32 | |
Factory Lead Time | 9 Weeks, 3 Days | |
Samacsys Manufacturer | Integrated Silicon Solution Inc. | |
Access Mode | MULTI BANK PAGE BURST | |
Access Time-Max | 0.4 ns | |
Additional Feature | AUTO/SELF REFRESH | |
Clock Frequency-Max (fCLK) | 400 MHz | |
I/O Type | COMMON | |
Interleaved Burst Length | 4,8 | |
JESD-30 Code | R-PBGA-B84 | |
JESD-609 Code | e1 | |
Length | 12.5 mm | |
Memory Density | 1073741824 bit | |
Memory IC Type | DDR2 DRAM | |
Memory Width | 16 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 84 | |
Number of Words | 67108864 words | |
Number of Words Code | 64000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 64MX16 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA84,9X15,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Qualification Status | Not Qualified | |
Refresh Cycles | 8192 | |
Seated Height-Max | 1.2 mm | |
Self Refresh | YES | |
Sequential Burst Length | 4,8 | |
Standby Current-Max | 0.025 A | |
Supply Current-Max | 0.28 mA | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 8 mm |
Alternate Parts for IS43DR16640C-25DBL
This table gives cross-reference parts and alternative options found for IS43DR16640C-25DBL. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IS43DR16640C-25DBL, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
---|---|---|---|---|
MT47H64M16NF-25E:M | Micron Technology Inc | $3.7779 | DDR DRAM, 64MX16, 0.4ns, CMOS, PBGA84, 8 X 12.50 MM, ROHS COMPLIANT, FBGA-84 | IS43DR16640C-25DBL vs MT47H64M16NF-25E:M |
IS43DR16640C-25DBLI | Integrated Silicon Solution Inc | $4.5347 | DDR DRAM, 64MX16, 0.4ns, CMOS, PBGA84, TWBGA-84 | IS43DR16640C-25DBL vs IS43DR16640C-25DBLI |
W971GG6KB-25 | Winbond Electronics Corp | Check for Price | DDR DRAM, 64MX16, 0.4ns, CMOS, PBGA84, 8 X 12.50 MM, ROHS COMPLIANT, WBGA-84 | IS43DR16640C-25DBL vs W971GG6KB-25 |
W971GG6KB25I | Winbond Electronics Corp | Check for Price | DDR DRAM, 64MX16, 0.4ns, CMOS, PBGA84, 8 X 12.50 MM, ROHS COMPLIANT, WBGA-84 | IS43DR16640C-25DBL vs W971GG6KB25I |
MT47H64M16NF-25E:MTR | Micron Technology Inc | Check for Price | DDR DRAM, 64MX16, CMOS, PBGA84, FBGA-84 | IS43DR16640C-25DBL vs MT47H64M16NF-25E:MTR |
MT47H64M16NF-25EXIT:M | Micron Technology Inc | Check for Price | DDR DRAM, 64MX16, 0.4ns, CMOS, PBGA84, 8 X 12.50 MM, ROHS COMPLIANT, FBGA-84 | IS43DR16640C-25DBL vs MT47H64M16NF-25EXIT:M |
IS43DR16640C-25DBL Frequently Asked Questions (FAQ)
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The maximum operating temperature range for the IS43DR16640C-25DBL is 0°C to 85°C.
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To ensure signal integrity, use a signal integrity analysis tool to simulate the signal behavior and optimize the PCB layout. Also, use a termination resistor on the address and control lines to reduce signal reflection.
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The recommended voltage for the VDD and VDDQ power supplies is 1.5V ± 0.075V.
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The IS43DR16640C-25DBL requires a refresh cycle every 64ms. The refresh command should be sent to the device during the self-refresh mode to maintain data integrity.
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The maximum clock frequency supported by the IS43DR16640C-25DBL is 1600MHz.