Datasheets
IRF420 by:

Power Field-Effect Transistor, 2.5A I(D), 500V, 3ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-204AA,

Part Details for IRF420 by Infineon Technologies AG

Results Overview of IRF420 by Infineon Technologies AG

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Applications Industrial Automation Motor control systems

IRF420 Information

IRF420 by Infineon Technologies AG is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.

A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.

Part Details for IRF420

IRF420 CAD Models

IRF420 Part Data Attributes

IRF420 Infineon Technologies AG
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IRF420 Infineon Technologies AG Power Field-Effect Transistor, 2.5A I(D), 500V, 3ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-204AA,
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Reach Compliance Code unknown
ECCN Code EAR99
Samacsys Manufacturer Infineon
Case Connection DRAIN
Configuration SINGLE
DS Breakdown Voltage-Min 500 V
Drain Current-Max (ID) 2.5 A
Drain-source On Resistance-Max 3 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR
JEDEC-95 Code TO-204AA
JESD-30 Code O-MBFM-P2
JESD-609 Code e0
Number of Elements 1
Number of Terminals 2
Operating Mode ENHANCEMENT MODE
Operating Temperature-Max 150 °C
Package Body Material METAL
Package Shape ROUND
Package Style FLANGE MOUNT
Polarity/Channel Type N-CHANNEL
Power Dissipation-Max (Abs) 50 W
Pulsed Drain Current-Max (IDM) 8 A
Qualification Status Not Qualified
Surface Mount NO
Terminal Finish TIN LEAD
Terminal Form PIN/PEG
Terminal Position BOTTOM
Transistor Element Material SILICON

Alternate Parts for IRF420

This table gives cross-reference parts and alternative options found for IRF420. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IRF420, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
IRF420 International Rectifier Check for Price Power Field-Effect Transistor, 2.5A I(D), 500V, 3ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-204AA IRF420 vs IRF420
IRF420 Harris Semiconductor Check for Price Power Field-Effect Transistor, 2.5A I(D), 500V, 3ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-204AA IRF420 vs IRF420

IRF420 Related Parts

IRF420 Frequently Asked Questions (FAQ)

  • The maximum safe operating area (SOA) for the IRF420 is not explicitly stated in the datasheet, but it can be determined by consulting Infineon's application note AN2013-03, which provides SOA curves for the device. The SOA is typically limited by the device's thermal and voltage ratings.

  • The junction-to-case thermal resistance (RthJC) for the IRF420 can be calculated using the thermal resistance values provided in the datasheet. RthJC is typically around 0.5-1.0 K/W for the IRF420, depending on the specific package and mounting conditions.

  • The recommended gate drive voltage for the IRF420 is typically between 10-15V, depending on the specific application and switching frequency. A higher gate drive voltage can improve switching performance, but may also increase power consumption and EMI.

  • Yes, the IRF420 is suitable for high-frequency switching applications up to several hundred kHz. However, the device's switching performance and losses should be carefully evaluated to ensure that it meets the specific application requirements.

  • To ensure proper cooling of the IRF420, a heat sink with a sufficient thermal conductivity should be used, and the device should be mounted with a suitable thermal interface material (TIM). The heat sink should be designed to dissipate the maximum expected power losses, and the device's thermal ratings should not be exceeded.

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