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Part Details for HSB07-202009 by Same Sky
Results Overview of HSB07-202009 by Same Sky
- Distributor Offerings: (7 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Security and Surveillance
Environmental Monitoring
Internet of Things (IoT)
Space Technology
Smart Cities
Aerospace and Defense
Healthcare
Agriculture Technology
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Robotics and Drones
Price & Stock for HSB07-202009
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
2223-HSB07-202009-ND
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DigiKey | HEAT SINK, BGA, 20 X 20 X 9 MM Min Qty: 1 Lead time: 16 Weeks Container: Box |
1553 In Stock |
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$0.5485 / $0.8700 | Buy Now |
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DISTI #
490-HSB07-202009
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Mouser Electronics | Heat Sinks heat sink, BGA, 20 x 20 x 9 mm RoHS: Compliant | 0 |
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$0.5480 / $0.9000 | Order Now |
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Onlinecomponents.com | 20 x 20 mm, BGA Heat Sink, Aluminum, PCB RoHS: Compliant |
1786 In Stock |
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$0.5390 / $0.8270 | Buy Now |
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DISTI #
88107409
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Verical | 20 x 20 mm, BGA Heat Sink, Aluminum, PCB RoHS: Compliant Min Qty: 52 Package Multiple: 1 | Americas - 517 |
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$0.6520 / $0.8060 | Buy Now |
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DISTI #
HSB07-202009
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TME | Heatsink: extruded, grilled, black, L: 20mm, W: 20mm, H: 9mm, anodized Min Qty: 1872 | 0 |
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$0.6500 | RFQ |
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DISTI #
HSB07-202009
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Chip One Stop | Electromechanicals RoHS: Compliant Min Qty: 1 Lead time: 0 Weeks, 1 Days Container: Bulk | 517 |
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$0.5300 / $0.8060 | Buy Now |
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Master Electronics | 20 x 20 mm, BGA Heat Sink, Aluminum, PCB RoHS: Compliant |
1786 In Stock |
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$0.5390 / $0.8270 | Buy Now |
Part Details for HSB07-202009
HSB07-202009 CAD Models
HSB07-202009 Part Data Attributes
HSB07-202009 Frequently Asked Questions (FAQ)
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CUI Devices recommends a PCB layout with a solid ground plane, minimal trace lengths, and a decoupling capacitor (e.g., 10nF) between the VCC and GND pins to reduce noise and ensure stable operation.
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To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a small amount of solder paste or flux to the pads. Avoid applying excessive heat or pressure, which can damage the component.
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The HSB07-202009 is rated for operation from -40°C to 85°C, but it's essential to note that the device's performance may degrade at extreme temperatures. Consult the datasheet for specific temperature-related specifications.
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While the HSB07-202009 is designed to be robust, it's still important to consider the vibration environment. CUI Devices recommends following the recommended mounting and soldering procedures to ensure the device remains securely attached to the PCB. Additionally, consider using vibration-dampening materials or mounting the PCB in a way that minimizes vibration transmission.
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The lead time for ordering the HSB07-202009 may vary depending on the quantity, region, and availability. It's best to check with CUI Devices or an authorized distributor for the most up-to-date lead time information.