-
Part Symbol
-
Footprint
-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
Part Details for HSA2-040SIA/A2S23 by Microchip Technology Inc
Results Overview of HSA2-040SIA/A2S23 by Microchip Technology Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
HSA2-040SIA/A2S23 Information
HSA2-040SIA/A2S23 by Microchip Technology Inc is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for HSA2-040SIA/A2S23
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
HSA2-040SIA/A2S23
|
EBV Elektronik | Sensor Controller Resistive 28Pin SOIC Tube (Alt: HSA2-040SIA/A2S23) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 5 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
Part Details for HSA2-040SIA/A2S23
HSA2-040SIA/A2S23 CAD Models
HSA2-040SIA/A2S23 Part Data Attributes
|
|
HSA2-040SIA/A2S23
Microchip Technology Inc
Buy Now
Datasheet
|
Compare Parts:
HSA2-040SIA/A2S23
Microchip Technology Inc
IC,TOUCH SENSOR/CONTROLLER,SOP,28PIN,PLASTIC
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Part Package Code | SOIC | |
| Package Description | 0.300 INCH, ROHS COMPLIANT, PLASTIC, MS-013, SOIC-28 | |
| Pin Count | 28 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 5 Weeks | |
| Samacsys Manufacturer | Microchip |
Alternate Parts for HSA2-040SIA/A2S23
This table gives cross-reference parts and alternative options found for HSA2-040SIA/A2S23. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HSA2-040SIA/A2S23, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| HSA2-040SIA/A2S23TR | Microchip Technology Inc | Check for Price | IC,TOUCH SENSOR/CONTROLLER,SOP,28PIN,PLASTIC | HSA2-040SIA/A2S23 vs HSA2-040SIA/A2S23TR |
| HSA2-040SIA | Microchip Technology Inc | Check for Price | SPECIALTY INTERFACE CIRCUIT, PDSO28, 0.300 INCH, PLASTIC, SOIC-28 | HSA2-040SIA/A2S23 vs HSA2-040SIA |
HSA2-040SIA/A2S23 Frequently Asked Questions (FAQ)
-
A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
-
Use a heat sink or thermal pad to dissipate heat. Ensure good airflow and avoid blocking airflow around the device. Consider using a thermal interface material to improve heat transfer.
-
Power up the device in the following sequence: VCC, VDD, and then VPP. Power down in the reverse sequence. Ensure a minimum of 100 ms delay between power-up and power-down sequences.
-
Use an ESD wrist strap or mat during handling and assembly. Ensure that the device is stored in an anti-static bag or container. Avoid touching the device pins or leads during handling.
-
Use a reflow soldering profile with a peak temperature of 240°C to 250°C, and a dwell time of 30 seconds to 60 seconds. Ensure that the device is properly aligned and secured during the soldering process.