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Part Details for HMC829LP6GETR by Analog Devices Inc
Results Overview of HMC829LP6GETR by Analog Devices Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Telecommunications
HMC829LP6GETR Information
HMC829LP6GETR by Analog Devices Inc is a Cellular Telephone Circuit.
Cellular Telephone Circuits are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Price & Stock for HMC829LP6GETR
| Part # | Distributor | Description | Stock | Price | Buy | |
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Rochester Electronics | HMC829 - Fractional-N PLL with Integrated VCO SMT RoHS: Compliant Status: End of Life / Last Time Buy Min Qty: 1 | 1866 |
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$16.8000 / $21.0000 | Buy Now |
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Win Source Electronics | IC PLL W/VCO FRACTIONAL-N 40QFN | 1000 |
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$127.9544 / $147.6402 | Buy Now |
Part Details for HMC829LP6GETR
HMC829LP6GETR CAD Models
HMC829LP6GETR Part Data Attributes
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HMC829LP6GETR
Analog Devices Inc
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Datasheet
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HMC829LP6GETR
Analog Devices Inc
Fractional-N PLL with Integrated VCO 45 - 1050, 1400 - 2100, 2800 - 4200 MHz
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| Pbfree Code | No | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ANALOG DEVICES INC | |
| Package Description | ROHS COMPLIANT, PLASTIC, QFN-40 | |
| Pin Count | 40 | |
| Manufacturer Package Code | HCP-40-1 | |
| Reach Compliance Code | compliant | |
| Samacsys Manufacturer | Analog Devices | |
| JESD-30 Code | S-PQCC-N40 | |
| Length | 6 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 40 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 0.9 mm | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | YES | |
| Telecom IC Type | RF AND BASEBAND CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 6 mm |
HMC829LP6GETR Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure good thermal conductivity by using a thermal pad and a heat sink if necessary.
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Use a network analyzer to measure the input and output impedance of the device, and then design the matching networks using a Smith chart or a circuit simulator like ADS or AWR.
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Derate the voltage by 10-15% and the current by 20-25% to ensure reliable operation over the entire operating temperature range.
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Use a stability analysis tool like the Nyquist plot or the Bode plot to identify potential instability issues, and add resistive or capacitive loading to the output stage if necessary.
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Handle the device with an ESD wrist strap or mat, and ensure that the PCB is designed with ESD protection diodes and resistors to prevent damage during assembly and testing.