Part Details for HMC788LP2E by Analog Devices Inc
Results Overview of HMC788LP2E by Analog Devices Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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HMC788LP2E Information
HMC788LP2E by Analog Devices Inc is an RF/Microwave Amplifier.
RF/Microwave Amplifiers are under the broader part category of RF and Microwave Components.
RF and Microwave Engineering focuses on the design and operation of devices that transmit or receive radio waves. The main distinction between RF and microwave engineering is their wavelength, which influences how energy is transmitted and used in various applications. Read more about RF and Microwave Components on our RF and Microwave part category page.
Price & Stock for HMC788LP2E
Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | RF & Microwave | 679 |
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RFQ |
Part Details for HMC788LP2E
HMC788LP2E CAD Models
HMC788LP2E Part Data Attributes
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HMC788LP2E
Analog Devices Inc
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Datasheet
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HMC788LP2E
Analog Devices Inc
0MHz - 10000MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ANALOG DEVICES INC | |
Package Description | 2 X 2 MM, ROHS COMPLIANT, PLASTIC, SMT, DFN-6 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.33.00.01 | |
Characteristic Impedance | 50 Ω | |
Construction | COMPONENT | |
Gain | 9 dB | |
Input Power-Max (CW) | 15 dBm | |
JESD-609 Code | e3 | |
Mounting Feature | SURFACE MOUNT | |
Number of Functions | 1 | |
Number of Terminals | 6 | |
Operating Frequency-Max | 10000 MHz | |
Operating Frequency-Min | ||
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Equivalence Code | SOLCC6,.08,25 | |
Power Supplies | 5 V | |
RF/Microwave Device Type | WIDE BAND LOW POWER | |
Surface Mount | YES | |
Technology | GAAS | |
Terminal Finish | Matte Tin (Sn) |
HMC788LP2E Frequently Asked Questions (FAQ)
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A good PCB layout for the HMC788LP2E involves keeping the RF signal paths as short as possible, using a solid ground plane, and minimizing the use of vias and thermal reliefs. It's also recommended to use a 4-layer PCB with a dedicated ground plane and to place the device near the edge of the board to minimize radiation.
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To optimize the HMC788LP2E for a specific frequency band, you can adjust the values of the external matching components (e.g. capacitors and inductors) to achieve the desired impedance match. You can use simulation tools such as ADS or AWR to model the device and optimize the matching network.
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The maximum power handling capability of the HMC788LP2E is typically limited by the device's thermal characteristics and the PCB's thermal design. As a general guideline, the device can handle up to 30 dBm of input power, but this may vary depending on the specific application and operating conditions.
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Common issues with the HMC788LP2E can often be attributed to poor PCB layout, incorrect component values, or inadequate power supply decoupling. To troubleshoot, start by verifying the PCB layout and component values, then check the power supply decoupling and noise filtering. If the issue persists, consider using a spectrum analyzer or network analyzer to characterize the device's performance.
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Yes, the HMC788LP2E can be used in a switching application, but it's essential to ensure that the device is properly biased and that the switching signal is properly filtered to prevent damage to the device. Additionally, the device's switching characteristics should be carefully evaluated to ensure that they meet the requirements of the specific application.