Part Details for HMC739LP4ETR by Hittite Microwave Corp
Results Overview of HMC739LP4ETR by Hittite Microwave Corp
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Audio and Video Systems
Aerospace and Defense
Telecommunications
Entertainment and Gaming
HMC739LP4ETR Information
HMC739LP4ETR by Hittite Microwave Corp is an Other Telecom IC.
Other Telecom ICs are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Price & Stock for HMC739LP4ETR
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-HMC739LP4ETR-ND
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DigiKey | TELECOM CIRCUIT, 1-FUNC, PQCC24 Min Qty: 6 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
2285 In Stock |
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$56.9100 | Buy Now |
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Rochester Electronics | Telecom Circuit, 1-Func, PQCC24 RoHS: Compliant Status: Active Min Qty: 1 | 2285 |
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$43.8900 / $54.8600 | Buy Now |
Part Details for HMC739LP4ETR
HMC739LP4ETR CAD Models
HMC739LP4ETR Part Data Attributes
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HMC739LP4ETR
Hittite Microwave Corp
Buy Now
Datasheet
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HMC739LP4ETR
Hittite Microwave Corp
Telecom Circuit, 1-Func, PQCC24, ROHS COMPLIANT, PLASTIC, QFN-24
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | HITTITE MICROWAVE CORP | |
| Package Description | ROHS COMPLIANT, PLASTIC, QFN-24 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-PQCC-N24 | |
| Length | 4 mm | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | YES | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Width | 4 mm |
HMC739LP4ETR Frequently Asked Questions (FAQ)
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The recommended PCB layout involves using a 4-layer board with a solid ground plane, and placing the device near a thermal pad or heat sink to dissipate heat. A thermal via array can also be used to improve heat dissipation.
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Optimizing the input and output matching networks involves using a combination of simulation tools and empirical methods to achieve the best possible impedance match. The device's datasheet provides a starting point for the matching network design, but further optimization may be necessary for specific applications.
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The recommended operating conditions include keeping the junction temperature below 150°C, avoiding exposure to moisture and humidity, and ensuring that the device is operated within its specified voltage and current ratings.
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Troubleshooting common issues involves using a combination of measurement tools such as spectrum analyzers and oscilloscopes, as well as simulation tools to identify and isolate the root cause of the problem. The device's datasheet and application notes can also provide guidance on troubleshooting and debugging.
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The device requires proper ESD protection and handling to prevent damage. This includes using ESD-safe materials and equipment, grounding oneself before handling the device, and avoiding exposure to static electricity.