Part Details for HMC703LP4ETR by Hittite Microwave Corp
Results Overview of HMC703LP4ETR by Hittite Microwave Corp
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- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Telecommunications
HMC703LP4ETR Information
HMC703LP4ETR by Hittite Microwave Corp is a PLL or Frequency Synthesis Circuit.
PLL or Frequency Synthesis Circuits are under the broader part category of Signal Circuits.
A signal is an electronic means of transmitting information, either as an analog signal with continuous values or a digital signal with discrete values. Signals are used in various systems and networks. Read more about Signal Circuits on our Signal Circuits part category page.
Part Details for HMC703LP4ETR
HMC703LP4ETR CAD Models
HMC703LP4ETR Part Data Attributes
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HMC703LP4ETR
Hittite Microwave Corp
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Datasheet
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HMC703LP4ETR
Hittite Microwave Corp
Phase Locked Loop,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | HITTITE MICROWAVE CORP | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Analog IC - Other Type | PHASE LOCKED LOOP | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 1 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Terminal Finish | MATTE TIN |
HMC703LP4ETR Frequently Asked Questions (FAQ)
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The recommended PCB layout involves using a 4-layer board with a solid ground plane, and placing the device near the edge of the board to minimize thermal resistance. Thermal management involves using a heat sink or thermal pad to dissipate heat, and ensuring good airflow around the device.
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Optimizing the input and output matching networks involves using simulation software such as ADS or AWR to design and optimize the matching networks for maximum gain and efficiency. The goal is to achieve a good impedance match between the device and the external circuitry.
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The recommended soldering technique is reflow soldering, and the assembly technique involves using a pick-and-place machine to ensure accurate placement of the device. It's also important to follow the recommended land pattern and soldering profile to prevent damage to the device.
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Ensuring proper biasing and configuration involves following the recommended biasing scheme and configuration settings outlined in the datasheet. This includes setting the correct voltage and current levels, and configuring the device for the desired operating mode.
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Potential sources of noise and interference include electromagnetic interference (EMI), radio-frequency interference (RFI), and thermal noise. These can be mitigated by using shielding, filtering, and grounding techniques, as well as ensuring good PCB layout and design practices.